High-Frequency RO4003c Double-Sided PCB – 32mil Thickness with Enig Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c PCB
• Model NO.: BIC-1012-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High-Frequency RO4003C Double-Sided PCB - 0.9mm Thickness with ENIG Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Product Overview
This high-performance double-sided PCB utilizes Rogers RO4003C laminate material to deliver exceptional RF/microwave performance at a competitive price point. Designed for demanding wireless applications, this 0.9mm thick circuit board combines the electrical properties of premium PTFE materials with the manufacturability of standard FR-4, making it an ideal solution for cost-sensitive high-frequency designs.

The board features an ENIG (Electroless Nickel Immersion Gold) surface finish that ensures excellent solderability and corrosion resistance, while the 4/4 mil trace/space capability allows for high-density component placement. With 151 resin-filled vias (IPC-4761 Type VII) and a panelized design (6-up on 139x100mm panels), this PCB offers both reliability and manufacturing efficiency.

2. PCB Construction Details

Specification	Detail
Base Material	Rogers RO4003C
Layer Count	Double-Sided
Dimensions	139mm x 100mm (6-up panel)
Thickness	0.9mm
Min Trace/Space	4/4 mils
Min Hole Size	0.5mm
Copper Weight	1 oz (35µm)
Via Treatment	0.5mm resin-filled
Surface Finish	ENIG
Dielectric Thickness	32mil
Quality Standard	IPC-Class-2

3. Key Features & Components
Advanced Material Properties
Consistent Performance: Dielectric constant of 3.38±0.05 at 10GHz
Low Signal Loss: Dissipation factor of just 0.0027 at 10GHz
Thermal Stability: CTE matched to copper (11/14 ppm/°C X/Y)
Moisture Resistance: Only 0.06% absorption for reliable operation

Board Configuration
Component Density: Supports 97 components (49 thru-hole, 81 SMT)
Interconnect Solution: 151 vias with resin filling for durability
Panel Utilization: 6 boards per panel for efficient production
File Format: Gerber RS-274-X for seamless fabrication


Typical Applications
5G Infrastructure: Base station antennas and power amplifiers
Automotive Electronics: Radar sensors and ADAS systems
Satellite Communications: LNB modules for broadcast systems

Why Choose This PCB?
1. Cost-Effective RF Solution: Processes like FR-4 with superior performance
2. High Reliability: Resin-filled vias and ENIG finish ensure durability
3. Design Flexibility: 4/4 mil trace/space enables compact layouts
4. Global Availability: Worldwide production and support



Thank you for your reading and you're welcome to contact us for your PCB enquiries.