1.1 General description
This is a type of flexible PCB for the application of Tracking Device. It's a 2 layer FPC at
0.15mm thick in a panel form. The base laminate is from ITEQ, It's fabricated per IPC 6012
Class 2 using supplied Gerber data.
1.2 Features and benifits
A. Excellent flexibility
C. Reducing the volume
D. Weight reduction
E. Consistency of assembly
F. Increased reliability
G. Controllability of electrical parameter design
H. The end can be whole soldered
I. Material optionality
J. Low cost
K. Continuity of processing
L. Competitive price
M. Delivery on time: >98%
1.3 Application
General purpose LED soft light strip, Tablet PC module soft board, Mobile phone module
flex board
1.4 Parameter and data sheet
Size of Flexible PCB |
119.50 X 50.38=8PCS |
Number of Layers |
2 |
Board Type |
Flexible PCB |
Board Thickness |
0.15mm |
Board Material |
Polyimide (PI) 25µm |
Board Material Supplier |
ITEQ |
Tg Value of Board Material |
60ºC |
|
PTH Cu thickness |
≥20 µm |
Inner Iayer Cu thicknes |
N/A |
Surface Cu thickness |
35 µm (1oz) |
|
Coverlay Colour |
Yellow |
Number of Coverlay |
2 |
Thickness of Coverlay |
25 µm |
Stiffener Material |
NO |
Stiffener Thickness |
N/A |
|
Type of Silkscreen Ink |
IJR-4000 MW300 |
Supplier of Silkscreen |
TAIYO |
Color of Silkscreen |
White |
Number of Silkscreen |
1 |
|
Peeling test of Coverlay |
No peelable |
Legend Adhesion |
3M 90ºC No peeling after Min. 3 times test |
|
Surface Finish |
Immersion Gold |
Thickness of Nickle/Gold |
Au: 0.03µm(Min.); Ni 2-4µm |
RoHS Required |
Yes |
Famability |
94-V0 |
|
Thermal Shock Test |
Pass, -25ºC±125ºC, 1000 cycles. |
Thermal Stress |
Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
Function |
100% Pass electrical test |
Workmanship |
Compliance with IPC-A-600H & IPC-6013C Class 2 |