RF-60A PCB Manufacturing of Shenzhen Electronics Circuit Board with Immersion Silver

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-145-V2.1
• Material: Organic-Ceramic Woven Fiberglass Reinforced Lamina
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Taconic
• Thickness: 50mil
• Layer Count: 2-Layer
• Application: Power Amplifiers
• Surface Finish: Immersion Silver
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

  RF-60A PCB Manufacturing of Shenzhen Electronics Circuit board With Immersion Silver
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

RF - 60A, part of Taconic's Organic CERamic (ORCER) family, is an organic - ceramic laminate with woven glass reinforcement. Taconic's know - how in ceramic fill technology and coated PTFE fiberglass has culminated in this product. RF - 60A displays extraordinary interlaminar bond strength and remarkable resistance to soldering. Its proprietary formula results in minimal moisture absorption and homogenous electrical properties.



The woven glass reinforcement of RF - 60A assures excellent dimensional stability and increases flexural strength. It shows low Z - axis expansion, which is crucial for the reliability of plated - through - holes under extreme thermal stress. With a dielectric constant of about 6.15, it is highly suitable for high DK products aiming for reduced circuit size and weight. Its low electrical loss factor makes it a prime selection for RF circuits.


RF - 60A laminates fully adhere to RoHS and WEEE directives and can withstand the temperatures required for new lead - free solders. They can be processed using standard methods for PTFE - woven fiberglass materials, such as shearing, drilling, milling, and plating, enabling mass production to be carried out.

Benefits (in general):
Low Moisture Absorption
Stable DK over Frequency
Dimensionally Stable
Low Z-axis Expansion
High Flexural Strength
Exceptional Interlaminar Bonds
 

Typical Applications:
Power Amplifiers
Filters & Couplers
Passive Components
Antennas

Our PCB Capabilities (RF-60A)

Our PCB Capability (RF-60A)
PCB Material:	Organic-ceramic Woven Fiberglass Reinforced Laminates
Designation:	RF-60A
Dielectric constant:	6.15 ±0.25
Dissipation Factor	DF 0.0038@10 GHz
Thermal Conductivity	0.4 W/MK
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 25mil (0.635mm), 31mil (0.787mm),           50mil (1.27mm), 60mil (1.524mm), 125mil (3.175mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, OSP, Immersion tin etc..

  
Data Sheet of Taconic RF-60A

RF-60A Typical Values
Property	Test Method	Unit	Value	Unit	Value
Dk @ 10 GHz	IPC-650 2.5.5.6		6.15		6.15
Df @ 10 GHz	IPC-650 2.5.5.5.1		0.0038		0.0038
Moisture Absorption	IPC-650 2.6.2.1	%	0.02	%	0.02
Dielectric Breakdown	IPC-650 2.5.6	kV	53	kV	53
Dielectric Strength	ASTM D 149	V/mil	880	kV/mm	35
Volume Resistivity	IPC-650 2.5.17.1 (After Humidity)	Mohm/cm	9.0 x 108	Mohm/cm	9.0 x 108
Surface Resistivity	IPC-650 2.5.17.1 (After Humidity)	Mohm	2.28 x 108	Mohm	2.28 x 108
Arc Resistance	IPC-650 2.5.1	Seconds	193	Seconds	193
Flexural Strength (MD)	ASTM D 790	psi	18,300	N/mm2	126.2
Flexural Strength (CD)	ASTM D 790	psi	14,600	N/mm2	100.7
Tensile Strength (MD)	ASTM D 3039	psi	19,500	N/mm2	134.4
Tensile Strength (CD)	ASTM D 3039	psi	16,300	N/mm2	112.4
Young's Modulus	ASTM D 3039	kpsi	1,590	N/mm2	11,000
Poisson's Ratio	ASTM D 3039		0.068	N/mm2	0.068
Compressive Modulus	ASTM D 695 (23°C)	kpsi	338		2,330
Peel Strength (1 oz. ED)	IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress)	lbs/in	8	N/mm	1.4
Dimensional Stability (MD)	IPC-650 2.4.39 Sec. 5.4 (After Bake)	mils/in	0.68	mm/M	0.68
Dimensional Stability (CD)	IPC-650 2.4.39 Sec. 5.4 (After Bake)	mils/in	1.05	mm/M	1.05
Density (Specific Gravity)	ASTM D 792	g/cm3	2.79	g/cm3	2.79
Thermal Conductivity	ASTM F 433	W/M*K	0.4	W/M*K	0.4
CTE (X axis)	ASTM D 3386 (-30°C - 125°C)	ppm/°C	9	ppm/°C	9
CTE (Y axis)	ASTM D 3386 (-30°C - 125°C)	ppm/°C	8	ppm/°C	8
CTE (Z axis)	ASTM D 3386 (-30°C - 125°C)	ppm/°C	69	ppm/°C	69
Outgassing (% TML)	ASTM E 595*	%	0.02	%	0.02
Outgassing (% CVCM)	ASTM E 595*	%	0.00	%	0.00
Outgassing (% WVR)	ASTM E 595*	%	0.01	%	0.01
Flammability Rating	UL 94		V-0		V-0