Tly-5 PCB for Satellite Stabilizer & Speaker Amplifier Boards for Welding Machine Manufacturers

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: CEM-4
• Model NO.: BIC-061-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Taonic
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year
• Package Size: 50.00cm * 30.00cm * 30.00cm
• Package Gross Weight: 2.000kg

Product Description

Taonic TLY-5, TLY-5-L, TLY-3, TLY-3FF High Frequency PCB Coating with HASL, Immersion Gold, OSP and Tin
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello Everyone,
Today, we're talking about high frequency PCB built on TLY material.

TLY laminates are manufactured with very lightweight woven fiberglass, which are from Taconic Company. They are more dimensionally stable than chopped fiber reinforced PTFE composites. Since they are more mechanically stable, it is suitable for high volume manufacturing.

The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.

We benefit from its following advantages:
1. Dimensionally stable:
   High volume fabrication becomes possible.
2. Lowest DF
   In the low dielectric constant range, the dissipation factor is approximately 0.0009 at 10 GHz.
3. Low moisture absorption
   It can work in severe environment.
4. High copper peel strength
   It's high up to 2.32, dimensionally stable.
5. Uniform and consistent DK
   For most thicknesses, the dielectric constant can be specified anywhere within this range with a tolerance of +/-0.02

Typical applications include:
Automotive radar
Cellular communications
Satellite communications
Power amplifiers, Filters, couplers
LNBs, LNAs, LNCs
Aerospace, avionics
Phased array antennas

There're 6 members in TLY family. We have stock for TLY-5. Others are purchased according to clients' requirement.

Our PCB Capability (TLY-5)

PCB Material:	Lightweight Woven Fiberglass
Designation:	TLY-5
Dielectric Constant:	2.2
Dissipation Factor	0.0009 10GHz
Layer Count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper Weight:	1oz (35µm), 2oz (70µm)
Laminate Thickness:	10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB Size:	≤400mm X 500mm
Solder Mask:	Green, Black, Blue, Yellow, Red etc.
Surface Finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

Bicheng specializes in providing you with prototype, small batches and mass production service.
If you have any questions, please feel free to contact us.
Thank you for your reading.

Appendix: Typical Values of TLY

TLY TYPICAL VALUES
Property	Test Method	Unit	Value	Unit	Value
DK at 10 GHz	IPC-650 2.5.5.5		2.2		2.2
Df at 10 GHz	IPC-650 2.5.5.5		0.0009		0.0009
Moisture Absorption	IPC-650 2.6.2.1	%	0.02	%	0.02
Dielectric Breakdown	IPC-650 2.5.6	kV	>45	kV	>45
Dielectric Strength	ASTM D 149	V/mil	2,693	V/mil	106,023
Volume Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms/cm	1010	Mohms/cm	1010
Volume Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms/cm	1010	Mohms/cm	109
Surface Resistivity	IPC-650 2.5.17.1(after elevated temp.)	Mohms	108	Mohms	108
Surface Resistivity	IPC-650 2.5.17.1(after humidity)	Mohms	108	Mohms	108
Flex Strength(MD)	IPC-650 2.4.4	psi	14,057	N/mm^2	96.91
Flex Strength(CD)	IPC-650 2.4.4	psi	12,955	N/mm^2	89.32
Peel Stength(½ oz.ed copper)	IPC-650 2.4.8	Ibs./inch	11	N/mm	1.96
Peel Stength(1 oz.CL1 copper)	IPC-650 2.4.8	Ibs./inch	16	N/mm	2.86
Peel Stength(1 oz..CV1 copper)	IPC-650 2.4.8	Ibs./inch	17	N/mm	3.04
Peel Stength	IPC-650 2.4.8(after elevated temp.)	Ibs./inch	13	N/mm	2.32
Young's Modulus(MD)	ASTM D 3039/IPC-650 2.4.19	psi	1.4 x 10^6	N/mm^2	9.65 x 10^3
Poisson's Ratio(MD)	ASTM D 3039/IPC-650 2.4.19		0.21		0.21
Thermal Conductivity	ASTM F 433	W/M*K	0.22	W/M*K	0.22
Dimensional Stability(MD,10mil)	IPC-650 2.4.39(avg.after bake&thermal stress)	mils/inch	-0.038		-0.038
Dimensional Stability(CD,10mil)	IPC-650 2.4.39(avg.after bake&thermal stress)	mils/inch	-0.031		-0.031
Density(Specific Gravity)	ASTM D 792	g/cm^3	2.19	g/cm^3	2.19
CTE(X axis)(25-260ºC)	ASTM D 3386(TMA)	ppm/ºC	26	ppm/ºC	26
CTE(Y axis)(25-260ºC)	ASTM D 3386(TMA)	ppm/ºC	15	ppm/ºC	15
CTE(Z axis)(25-260ºC)	ASTM D 3386(TMA)	ppm/ºC	217	ppm/ºC	217
NASA Outgassing(% TML)			0.01		0.01
NASA Outgassing(% CVCM)			0.01		0.01
NASA Outgassing(% WVR)			0.00		0.00
UL-94 Flammability Rating	UL-94		V-0		V-0