| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | Rogers RO4350b + RO4450f Bondply |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Product Overview
Our 18-layer high frequency PCB utilizes Rogers RO4350B laminate with RO4450F bondply, designed for demanding RF and microwave applications. This multilayer board features a robust 3.2mm thickness with dual surface finish (ENIG + selective hard gold) for superior performance in high-power applications.
Key Specifications
| Parameter | Specification |
|---|---|
| Base Material | Rogers RO4350B + RO4450F Bondply |
| Layer Count | 18 layers |
| Dimensions | 218 × 497 mm (±0.15mm) |
| Thickness | 3.2mm |
| Copper Weight | 1oz (35μm) all layers |
| Trace/Space | 4/4 mils minimum |
| Min Hole Size | 0.4mm |
| Via Technology | Blind vias (L11-L18) |
| Via Treatment | All resin-filled and capped |
| Surface Finish | ENIG + Selective Hard Gold (50μ") |
| Solder Mask | Blue (both sides) |
| Silkscreen | White (both sides) |
| Special Features | Via-in-pad, Press-fit holes |
| Quality Standard | IPC-Class 2 |
| Testing | 100% electrical test |
Material Properties
RO4350B Core:
Dielectric Constant: 3.48±0.05 @10GHz/23°C
Dissipation Factor: 0.0037 @10GHz/23°C
Thermal Conductivity: 0.69 W/m/KB
CTE: X=10, Y=12, Z=32 ppm/°C
Tg: >280°C
Water Absorption: 0.06%
UL 94 V-0 rated
Material Properties
RO4350B Core:
Dielectric Constant: 3.48±0.05 @10GHz/23°C
Dissipation Factor: 0.0037 @10GHz/23°C
Thermal Conductivity: 0.69 W/m/KB
CTE: X=10, Y=12, Z=32 ppm/°C
Tg: >280°C
Water Absorption: 0.06%
UL 94 V-0 rated
PCB Stackup
Copper_layer_1 - 35 μm
Rogers RO4350B Core - 0.102 mm (4mil)
Copper_layer_2 - 35 μm
-----------4mil RO4450F Bondply -------------
Copper_layer_3 - 35 μm
Rogers RO4350B Core - 0.102 mm (4mil)
Copper_layer_4 - 35 μm
-----------4mil RO4450F Bondply -------------
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Copper_layer_15 - 35 μm
Rogers RO4350B Core - 0.102 mm (4mil)
Copper_layer_16 - 35 μm
-----------4mil RO4450F Bondply -------------
Copper_layer_17 - 35 μm
Rogers RO4350B Core - 0.102 mm (4mil)
Copper_layer_18 - 35 μm
PCB Statistics
Components: 651
Total Pads: 779
Thru-hole Pads: 338
SMT Pads: 441 (Top:262, Bottom:179)
Vias: 632
Nets: 12
Artwork Format: Gerber RS-274-X
Global Availability
Typical Applications
5G Cellular Base Station Antennas
High-Power RF Amplifiers
Automotive Radar Systems
Satellite Communication (LNB)
RF Identification Systems
Aerospace Electronics
Quality Assurance
IPC-Class 2 compliant
100% electrical testing
Dimensional stability control
Reliable plated through-hole quality
Severe thermal shock resistant
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