| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | Rogers RO3003 + RO3210 Hybrid |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Product Overview
RO3210
Rogers' RO3210 high-frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass, engineered to deliver exceptional electrical performance and superior mechanical stability. A key feature of these materials is their enhanced mechanical properties.
RO3210 laminates offer the smooth surface of non-woven PTFE for precise line etching, combined with the rigidity of woven-glass PTFE laminates. They can be fabricated into printed circuit boards using standard PTFE processing techniques.
RO3003
Rogers RO3003 high-frequency laminates are ceramic-filled PTFE composites designed for commercial microwave and RF applications. These laminates provide excellent stability of dielectric constant (Dk) across a range of temperatures and frequencies, effectively eliminating the typical step change in Dk that occurs near room temperature in PTFE-glass materials. This makes RO3003 ideal for applications such as automotive radar (77 GHz), advanced driver assistance systems (ADAS), and 5G wireless infrastructure (mmWave).
Key Specifications
| Parameter | Specification |
|---|---|
| Base Material | Rogers RO3003 + RO3210 hybrid |
| Layer Count | 3 layers |
| Dimensions | 62.8 × 62.8 mm (±0.15mm) |
| Thickness | 3.0mm |
| Copper Weight | 1oz (35μm) outer layers |
| Trace/Space | 7/9 mils minimum |
| Min Hole Size | 0.4mm |
| Via Technology | Blind vias (L2-bottom) |
| Surface Finish | Immersion Tin |
| Solder Mask | None (both sides) |
| Silkscreen | None (both sides) |
| Quality Standard | IPC-Class 2 |
| Testing | 100% electrical test |
Material Properties
RO3210 Characteristics:
Dielectric Constant: 10.2±0.5
Dissipation Factor: 0.0027 @10GHz
CTE: X=13, Y=13, Z=34 ppm/°C
Thermal Conductivity: 0.81 W/mK
Td: 500°C (TGA)
UL 94 V-0 rated
Excellent mechanical stability
RO3003 Characteristics:
Dielectric Constant: 3.0±0.04 @10GHz/23°C
Dissipation Factor: 0.001 @10GHz/23°C
CTE: X=17, Y=16, Z=25 ppm/°C (-55 to 288°C)
Thermal Conductivity: 0.5 W/mK
Water Absorption: 0.04%
Td: >500°C
PCB Stackup
The 3-layer hybrid construction features:
Top Layer: 35μm Cu
Rogers RO3003 Core: 1.524mm (60mil)
RO4450F Bondply: 0.101mm (4mil)
Middle Layer: 35μm Cu
Rogers RO3210 Core: 1.27mm (50mil)
Bottom Layer: 35μm Cu
PCB Statistics
Components: 21
Total Pads: 47
Thru-hole Pads: 35
SMT Pads: 12 (Top only)
Vias: 24
Nets: 4
Artwork Format: Gerber RS-274-X
Global Availability
Typical Applications
Automotive radar systems (77GHz)
ADAS (Advanced Driver Assistance Systems)
5G wireless infrastructure (mmWave)
GPS satellite antennas
Microstrip patch antennas
Wireless broadband systems
Base station components
Remote monitoring systems
Quality Assurance
IPC-Class 2 compliant
100% electrical testing
Dimensional stability control
Reliable plated through-hole quality
Severe thermal shock resistant
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