4 Layer PCB Fr4 Tg150 Immersion Gold Printed Circuit Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Fr-4 Tg150°c
• Model NO.: BIC-452-V3.0
• Material: Fr-4 (Iteq)
• Application: Industrial Computing Systems
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid-Flexible PCB
• Processing Technology: Enig
• Base Material: Fr-4 Tg150°c
• Insulation Materials: Glass Epoxy
• Brand: Shengyi
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Express Boxed
• Specification: 119 mm x 80 mm (1 piece)
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom-manufactured PCBs tailored to your high-frequency design requirements. Images and specs are illustrative.)

 

Product Overview

This multilayer PCB utilizes FR-4 substrate with Tg 150°C for mobile phone applications, featuring advanced blind via technology. The 1.6mm thick board combines white silkscreen (Taiyo) on green solder mask (Taiyo) with immersion gold finish for superior pad protection. Manufactured using ITEQ materials per IPC 6012 Class 2 standards, it includes blind vias connecting top-to-inner layer 1 and inner layer 3-to-bottom configurations. Shipped in batches of 25 boards with no minimum order quantity.
 

Key Features

Middle Tg FR-4 material delivers low Z-CTE and exceptional through-hole reliability while immersion gold finish ensures high solderability with minimal contamination. Our production capabilities include a 16,000m² facility handling 8,000+ PCB variants monthly with >98% on-time delivery rate. The multilayer design optimizes component connectivity in compact layouts.

 

Advanced PCB Via Technology:
Blind/buried vias (GTL-L2, L3-L8, L3-GBL) and resin-filled microvias (≤0.4mm) for reliability.

 

Technical Specifications

Base Material: FR-4 Tg150°C (ITEQ)
Layer Count: 4 layers
Board Thickness: 1.6mm
Surface Finish: Immersion Gold
Solder Mask: Green (Taiyo)
Silkscreen: White (Taiyo)
Via Technology: Blind vias (top-L1/L3-bottom)
Certification: IPC 6012 Class 2

 

 

Applications

Industrial computing systems
GPS tracking devices
POS terminal hardware
Embedded control systems
Data acquisition modules
Microcontroller interfaces
Computer/notebook components

 

Parameter and data sheet

PCB SIZE	119 x 80mm=1PCS
BOARD TYPE	Multilayer PCB
Number of Layers	4 layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 18um(0.5oz)+plate TOP layer
	Core FR-4 0.61mm
	copper ------- 35um(1oz) MidLayer 1
	Prepreg 0.254mm
	copper ------- 35um(1oz) MidLayer 2
	Core FR-4 0.61mm
	copper -------  18um(0.5oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space:	4 mil / 4 mil
Minimum / Maximum Holes:	0.3 mm /3.5 mm
Number of Different Holes:	9
Number of Drill Holes:	415
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	FR-4 Tg150ºC, er<5.4.IT-158,  ITEQ
Final foil external:	1oz
Final foil internal:	1oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Immersion Gold
Solder Mask Apply To:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Green, PSR-2000 GT600D, Taiyo Supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing, stamp holes.
MARKING
Side of Component Legend	TOP and Bottom.
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through hole(PTH), minimum size 0.3mm. Blind Via Top to Inner layer 1, Bottom to Inner layer 2
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCB.DOC etc
SERVICE AREA	Worldwide, Globally.

 

Composition of Holes

1. Via Types
1.1 Blind Via
Connect surface layers to adjacent inner layers
Depth controlled within aspect ratio limits
Enable high-density interconnects

 

1.2 Buried Vias
Connect inner layers only
Fabricated during pre-lamination
Maintain surface layer integrity

 

1.3 Through Vias
Penetrate entire board thickness
Most cost-effective solution
Default via type unless specified

 

2. Via Structure
Drill Hole: Conducts electrical signals
Pad Area: Provides mechanical support

 

3. Design Considerations
Smaller vias maximize routing space
Must maintain manufacturable aspect ratios
Critical for high-speed/high-density designs
Balance size reduction with reliability

 

This optimized via technology enables compact PCB layouts while ensuring signal integrity and manufacturing feasibility. Our engineering team can recommend the optimal via configuration for your specific application requirements.

PCB capability 2025

Factory Process Capability (2025)
Substrate Types	Standard FR-4, High Tg FR-4, High Frequency Materials, Rigid Polyimide, Flexible Polyimide, Transparent PET Materials, AL2O3 Ceramic, AlN Ceramic etc.
Substrate Brands	Shengyi, ITEQ, KB, Isola, Taiwan Union, Rogers Corp. Taconic, Wangling, Panasonic etc
Board Types	Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB, Heavy Copper, High Speed, High frequency etc.
Copper Clad Laminates(CCL)	High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, TU-883, IT-180A, FR408HR, 370HR,                                                                                          High CTI FR-4: S1600L, ST115                                                                 High speed: M6 (R5775G Core / R-5670 Prepreg)
	Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW;  CuClad 217, CuClad 233, CuClad 250.
	Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30,  RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3
	Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300; F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300; F4BTM298, F4BTM300, F4BTM320, F4BTM350; F4BTME298, F4BTME300, F4BTME320, F4BTME350; TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500; TF300, TF440, TF600, TF960, TF1020, TF1600; F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000; TFA294, TFA300, TFA615, TFA1020; WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615.
Maximum Delivery Size	1200mm x 572 mm
Minimum Finished Board Thickness	L≤2L: 0.15mm; 4L: 0.4mm
Maximum Finished Board Thickness	10.0 mm
Blind Buried Holes (Non-crossing)	0.1mm
Maximum Hole Aspect Ratio	15:01
Minimum Mechanical Drill Hole Diameter	0.1 mm
Through-hole Tolerance	+/- 0.0762 mm
Press-fit Hole Tolerance	+/- 0.05mm
Non-plated Copper Hole Tolerance	+/- 0.05mm
Maximum Number of Layers	32
Internal and External Layer Maximum Copper Thickness	12Oz
Minimum Drill Hole Tolerance	+/- 2mil
Minimum Layer-to-Layer Tolerance	+/- 3mil
Minimum Line Width/Spacing	3mil/3mil
Minimum BGA Diameter	8mil
Impedance Tolerance	< 50 ±5; ≥50±10%
Special Technology	High density interconnection (HDI), Hybrid design/ mixed PCB, Blind/Buried vias, Resin filled / copper filled and capped, Copper coin embedded, Staircase PCB, Edge plated PCB,  Heavy copper PCB, Half holes/castled Edge holes, Thick PCB etc
Surface Treatment Processes	Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc.