8-Layer HDI RF PCB RO4350b Printed Circuit Board Enepig Finish with 94V0

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO4350b
Shipping & Policy
Shipping Cost: Contact the supplier about freight and estimated delivery time.
Payment Methods:
visa mastercard discover JCB diners club american express T/T
PIX SPEI OXXO PSE OZOW PayPal
  Support payments in USD
Secure payments: Every payment you make on Made-in-China.com is protected by the platform.
Refund policy: Claim a refund if your order doesn't ship, is missing, or arrives with product issues.
Secured Trading Service
Gold Member Since 2017

Suppliers with verified business licenses

Audited Supplier Audited Supplier

Audited by an independent third-party inspection agency

to see all verified strength labels (14)
  • 8-Layer HDI RF PCB RO4350b Printed Circuit Board Enepig Finish with 94V0
  • 8-Layer HDI RF PCB RO4350b Printed Circuit Board Enepig Finish with 94V0
  • 8-Layer HDI RF PCB RO4350b Printed Circuit Board Enepig Finish with 94V0
  • 8-Layer HDI RF PCB RO4350b Printed Circuit Board Enepig Finish with 94V0
  • 8-Layer HDI RF PCB RO4350b Printed Circuit Board Enepig Finish with 94V0
  • 8-Layer HDI RF PCB RO4350b Printed Circuit Board Enepig Finish with 94V0
Find Similar Products

Basic Info.

Model NO.
BIC-453-V3.0
Material
RO4350b (Woven Glass Reinforced Hydrocarbon/Cerami
Application
RF Identification Tags
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Enepig
Base Material
RO4350b Laminate with RO4450f Bondply
Insulation Materials
RO4350b and RO4450f
Brand
Rogers
Board Types
Rigid PCB
Test
100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, Pcbdoc etc
Service Area
Worldwide, Globally
Transport Package
Express Boxed
Specification
119 mm x 80 mm (1 piece)
Trademark
bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

 

Introduction to RO4350B Core and RO4450F Bondply

Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics that provide electrical performance similar to PTFE/woven glass while maintaining manufacturability like epoxy/glass. RO4350B laminates offer tight control on dielectric constant (Dk) and low loss, making them cost-effective alternatives to conventional microwave laminates. They are rated UL 94 V-0 for active devices and high-power RF designs.

 

The RO4450F bondply is compatible with multi-layer constructions and offers a high post-cure Tg, making it ideal for sequential laminations. It demonstrates improved lateral flow capability, making it suitable for designs with challenging fill requirements.

 

RO4350B Material Features

Dielectric Constant: DK 3.48 ± 0.05 at 10GHz/23°C
Dissipation Factor: 0.0037 at 10GHz/23°C
Thermal Conductivity: 0.69 W/m/°K
CTE (Coefficient of Thermal Expansion): X-axis 10 ppm/°C, Y-axis 12 ppm/°C, Z-axis 32 ppm/°C
High Tg Value: >280°C
Low Water Absorption: 0.06%

 

RO4450F Bondply Features

Optimal dielectric constant (Dk 3.52±0.05)
Low dissipation factor (Df 0.004 @10GHz)
Excellent thermal conductivity (0.65 W/m/K)
Superior lamination compatibility
Multiple lamination cycle capability

 

PCB Construction Details

   
Base Material RO4350B
Layer Count 8-layer
Board Dimensions 96.4 mm x 163.9 mm (3 Types = 3 PCS, +/- 0.15 mm)
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.4 mm
Blind Vias GTL-L7, L3-GBL, GTL-L2, L7-GBL, GTL-L3, GTL-L4, GTL-L5, L5-GBL, L4-GBL, GTL-L6, L6-GBL, L2-GBL, mechanical drill
Finished Board Thickness 1.8 mm
Finished Copper Weight 1 oz (1.4 mils) outer layers; 1 oz (1.4 mils) / 0.5 oz (0.7 mils) inner layers
Via Plating Thickness 20 µm
Surface Finish Electroless Nickel Immersion Gold
Top Silkscreen White
Bottom Silkscreen White
Top Solder Mask Green
Bottom Solder Mask Green
Vias All are resin filled and capped
Testing 100% Electrical test prior to shipment
Impedance Control 50 ohm on various layers


 

 
8-Layer HDI RF PCB RO4350b Printed Circuit Board Enepig Finish with 94V0
8-Layer HDI RF PCB RO4350b Printed Circuit Board Enepig Finish with 94V0

 

PCB Stackup: 8-layer Rigid PCB

Copper Layer 1: 17 µm + plating
RO4350B Core: 0.168 mm (6.6 mils)
Copper Layer 2: 17 µm
8 mil RO4450F Bondply
Copper Layer 3: 35 µm
RO4350B Core: 0.127 mm (5 mils)
Copper Layer 4: 17 µm
20 mil RO4450F Bondply
Copper Layer 5: 17 µm
RO4350B Core: 0.127 mm (5 mils)
Copper Layer 6: 35 µm
8 mil RO4450F Bondply
Copper Layer 7: 17 µm
RO4350B Core: 0.168 mm (6.6 mils)
Copper Layer 8: 17 µm + plating

 

PCB Statistics

Components: 76
Total Pads: 303
Thru Hole Pads: 117
Top SMT Pads: 121
Bottom SMT Pads: 65
Vias: 335
Nets: 6

 

 

Typical Applications

Cellular Base Station Antennas
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites

 

Artwork and Quality Standards

The artwork supplied for this PCB is in the Gerber RS-274-X format, adhering to IPC-Class-2 quality standards. This product is available for distribution worldwide.
 

 

 

 

 
8-Layer HDI RF PCB RO4350b Printed Circuit Board Enepig Finish with 94V0
8-Layer HDI RF PCB RO4350b Printed Circuit Board Enepig Finish with 94V0
8-Layer HDI RF PCB RO4350b Printed Circuit Board Enepig Finish with 94V0

 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now