| Customization: | Available |
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| Type: | Flexible Circuit Board |
| Dielectric: | Polyimide |
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(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Product Overview
Our FR-4 Stiffener Flexible Printed Circuits (FPC) are custom-made solutions tailored for surveillance systems and other precision applications. This single-layer FPC, with a thickness of 0.15mm, is constructed using Shengyi base laminate and adheres to IPC 6012 Class 2 standards. The design incorporates FR-4 stiffeners on the tails and polyimide stiffeners on the inserting heads, ensuring optimal support and flexibility.
Key Features and Benefits
1.Excellent Flexibility: Designed to bend and flex without compromising performance.
2.Weight and Volume Reduction: Ideal for compact and lightweight applications.
3.Assembly Consistency: Ensures uniform assembly processes.
4.Increased Reliability: Durable construction for long-term use.
5.Cost-Effective: Affordable solutions with no minimum order quantity.
6.Efficient Processing: Seamless continuity in manufacturing.
Parameter and Data Sheet
| Size of Flexible PCB | 230.5 X 30.8mm |
| Number of Layers | 1 |
| Board Type | Flexible PCB |
| Board Thickness | 0.15mm |
| Board Material | Polyimide (PI) 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60ºC |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35µm (1oz) |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | Polyimide |
| Stiffener Thickness | 0.2mm |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Applications
Our FR-4 Stiffener FPCs are widely used in:
Mobile phone built-in antennas
Mobile phone battery flex boards
Industrial surveying and mapping instruments
Understanding Stiffeners in Flexible PCBs
In applications requiring soldered components, flexible circuit boards often need external stiffeners for added support. Common stiffener materials include:
1.PI or Polyester Film: Thickness: 125μm (5mil)
Provides moderate hardness and flexibility.
2.Glass Fibers (FR-4): Thickness range: 125μm (5mil) to 3.175mm (125mils)
Offers higher hardness for demanding applications.
3.Polymer Materials: ow water absorption with high pressure and temperature resistance.
4.Steel Foil and Aluminum Shim: High hardness and excellent heat dissipation properties.
Why Choose Our FR-4 Stiffener FPCs?
Our FR-4 Stiffener Flexible Printed Circuits are engineered to meet the highest industry standards, offering unmatched flexibility, durability, and cost efficiency. Whether you need a prototype or large-scale production, we provide customized solutions to fit your requirements.
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