Power Distribution PCB on 3.2mm Fr-4 with 4 Oz Copper

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-998-V9.98
• Material: Fiberglass Epoxy
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Board Thick: 3.20mm
• Surface Finish: HASL Lead Free
• out Layer Copper: 140 Um (4 Oz)
• Soldermask Color: Blue
• Silkscreen Color: White
• Mininum Trace (Mil): 15.8 Mil
• Minimum Gap(Mil): 15.8 Mil
• Via: Plated Through Hole(Pth)
• RoHS Required: Yes
• Test: 100% Electrical Test
• Transport Package: Vacuum
• Specification: 120mm x 120mm =1pcs
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000 PCS/ Month

Product Description

1.1 General description

This is a type of heavy copper PCB built on FR-4 substrate with Tg 150°C for the application
of Solar power converters . It's 3.2 mm thick with white silkscreen(Taiyo) on blue solder mask
(Kuangshun) and immersion gold on pads. The base material is from ITEQ supplying 1 up PCB
per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards
are packed for shipment. 

1.2 Features and benifits    
    
a. Low Z-CTE and excellent through hole reliability
b. Excellent wetting during component soldering and it can avoid copper corrosion.
c. Large current can pass through steadily
d. Comprehensive equipment management and maintenance and process control
e. 8000 types of PCB per month
f.  12 hours quotation
g. Prototype PCB capability

1.3 Application

Power LED, Power Converters, External Power Supply, 1U Power Supply, Bipolar Power
Supply, Electronics Power Supply, Switched Mode Power Supplies, Inverter DC AC, AC
DC Converters, AC DC Inverter
    
1.4 Parameter and data sheet

Number of Layers	2 Layers
Board Type	Double Sided PCB
Board Thickness	3.20 mm +/-10%
Board Size	120 x 120mm=1UP
Board Material	FR-4 IT158
Board Material Supplier	ITEQ
Tg Value of Board Material	150ºC
PTH Cu thickness	≥20 um (See hole wall details)
Inner Iayer Cu thicknes	-
Surface Cu thickness	140 um (4 oz)
Solder Mask Type and Model No.	LPSM, KSM-6189BL04/KSM-19H01
Solder Mask Supplier	KUANG SHUN
Solder Mask Colour	Blue
Number of Solder Masks	2
Thickness of Solder Mask	14 um
Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	1
Mininum Trace (mil)	15.8 mil
Minimum Gap(mil)	15.8 mil
Surface Finish	HASL Lead free
RoHS Required	Yes
Warpage	0.25%
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds  Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H  & IPC-6012C Class 2
Drill table (mm)	T1: 2.500
	T2: 3.000
	T3: 4.600