OSP PCB on 1.6mm Tg170 Fr-4 White Solder Mask

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-0352-V3.52
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Surface Cu Thickness
1oz
Final Height of PCB
1.60±10%mm
Surface Finish
OSP
Solder Mask Color
White
Colour of Component Legend
Black
Mininum Trace (Mil)
6 Mil
Minimum Gap(Mil)
5.2 Mil
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
110.72 X 112.42mm=50up
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000PCS/Month

Product Description

1.1 General description

This is a type of 2 layer PCB board built on FR-4 Tg135 substrate for the application
of USB WiFi. It's 1.6 mm thick with black silkscreen on white solder mask and OSP
on pads. The base material is from ITEQ supplying 50 up boards per panel. They're
fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are
packed for shipment. 

1.2 Features and benifits    
    
A. RoHS compliant and suitable for thermal reliability needs.
B. Very Low Moisure Absorption and better CAF resistance.
C. Meeting your PCB needs from prototype to mass production.
D. 30000 square meter month capability
E. 12 hours quotation
F. Free stencil shim sent for new user

1.3 Application
    
Routers, Detector, 3G Mobile, Circuit Boards, 24V Inverter, Directional WiFi Antenna,
Routeur 3G, PLC Direct, Applications Of Embedded Systems, Solid state drives

1.4 Parameter and data sheet
Item Description Content
Board type Double sided PCB Double Sided Ccircuit
Layer count 2 Layer PCB 2 Layer PCB Board
Board size 110.72 X 112.42mm=50up 110.72 X 112.42mm=50up
Laminate Type FR-4 TG170
Supplier ITEQ
Board thickness 1.60±10%mm
Outer copper foil >=35 um
Inner copper foil 1/1 OZ
Warp-twist <= 0.75%
Legend Type KUANG SHUN
Color Black
Location CS & SS
Marking Co.logo YES
UL.logo  YES
Date code WWYY
Marking form /
Location CS
Min line width (mil) 6
Min line spacing (mil) 5.2
Min ring width (mil) NA  
Solder Mask Type KUANG SHUN
Color White
Thickness >=10 um
Pencil Test 6H OR ABOVE 
SOLVENT TEST NO ATTACK
TAPE TEST  NO PEEL OFF
Surface Treament OSP
Special Treament Silk screen /
Location /
Forming V-cut
Normal Testing Electrical test 100% PCB passed 
Visual inspection IPC-A-600H&IPC-6012B
Solderability Test  245ºC 5S 1 Cycle
Drill table (mm) No  Size
1 0.838±0.076
2 0.914±0.076
3 0.965±0.076
4 1.016±0.076
5 1.219±0.076
6 1.320±0.076
7 1.400±0.076
8 1.600±0.076
9 1.700±0.076
10 2.032±0.076
11 2.540±0.076
12 3.000±0.076
13 3.500±0.05

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