High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO4350b (Woven Glass Reinforced Hydrocarbon/Ceram
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  • High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0
  • High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0
  • High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0
  • High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0
  • High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0
  • High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0
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Basic Info.

Model NO.
BIC-479-V3.0
Material
Woven Fiberglass/PTFE Composite
Application
RF Identification Tags
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Immersion Gold
Base Material
Glass Epoxy Laminate
Insulation Materials
RO4350b Core with Prepreg RO4450f
Brand
Rogers
Board Types
Rigid PCB
Test
100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, PCB.Doc etc
Service Area
Worldwide, Globally
Transport Package
Express Boxed
Specification
70 mm x 50 mm (± 0.15 mm)
Trademark
bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Introduction to RO4350B

Rogers RO4350B is a proprietary woven glass reinforced hydrocarbon/ceramic material that offers electrical performance comparable to PTFE combined with the manufacturability of epoxy/glass. This material is designed for high-frequency applications, providing low dielectric loss and tight control over dielectric constant (Dk). Unlike traditional microwave laminates, RO4350B does not require special handling or treatments for through-holes, making it a cost-effective solution for RF designs.

 

 

Key Features of RO4350B

Dielectric Constant (Dk): 3.48 ± 0.05 at 10 GHz/23°C
Dissipation Factor: 0.0037 at 10 GHz/23°C
Thermal Conductivity: 0.69 W/m·K
CTE: X-axis: 10 ppm/°C, Y-axis: 12 ppm/°C, Z-axis: 32 ppm/°C
Tg: >280°C
Low Water Absorption: 0.06%

High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0

 


PCB Construction Details

Parameter Details
Base Material RO4350B
Layer Count 4 layers
Board Dimensions Outline 1: 70 mm x 50 mm (1 PCS, ± 0.15 mm)
  Outline 2: 70 mm x 40 mm
Minimum Trace/Space 4/7 mils
Minimum Hole Size 0.3 mm
Stepped Outline Yes
Finished Board Thickness 0.5 mm
Finished Copper Weight 1 oz (1.4 mils) for outer layers
Via Plating Thickness 20 µm
Blind and Buried Vias L1-L2, L1-L3, L2-L3
Surface Finish Immersion Gold
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
Electrical Testing 100% before shipment



PCB Stackup

Layer Details
Copper Layer 1 35 µm
Rogers RO4350B Core 0.762 mm (30 mil)
Copper Layer 2 35 µm
Prepreg (RO4450F) 0.102 mm (4 mil)
Copper Layer 3 35 µm
Rogers RO4350B Core 0.762 mm (30 mil)
Copper Layer 4 35 µm
   
   
   
   

 

PCB Statistics

Components: 9
Total Pads: 32B
Thru Hole Pads: 17
Top SMT Pads: 15
Bottom SMT Pads: 0
Vias: 23
Nets: 4

 

Artwork and Standards

Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

 

Benefits of RO4350B

Ideal for multi-layer board (MLB) constructions
Compatible with FR-4 processing at lower fabrication costs
Excellent dimensional stability
Competitively priced

 

Applications

Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites

 
High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0
High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0
High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0
High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0
High-Performance 4-Layer HDI PCB Using RO4350b Material with 94V0

 

 

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