| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | RO4003c (Woven Glass Reinforced Hydrocarbon/Ceram |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction to RO4003C
Rogers RO4003C is a proprietary, woven glass reinforced hydrocarbon/ceramic material that combines the electrical performance of PTFE with the manufacturability of epoxy/glass. This innovative material is designed for superior high-frequency performance and cost-effective circuit fabrication. RO4003C features low dielectric loss, making it suitable for applications where traditional laminates fall short at higher frequencies. It is ideal for RF microwave circuits, matching networks, and controlled impedance transmission lines.
Key Features of RO4003C
Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
Dissipation Factor: 0.0027 at 10 GHz
Thermal Conductivity: 0.71 W/m·K
Thermal Coefficient of Dk: +40 ppm/°C (range: -50°C to 150°C)
CTE Matched to Copper: 11 ppm/°C (X-axis), 14 ppm/°C (Y-axis)
Low Z-Axis CTE: 46 ppm/°C
Glass Transition Temperature (Tg): >280°C
Low Moisture Absorption: 0.06%
PCB Construction Details
| Parameter | Details |
|---|---|
| Base Material | RO4003C |
| Layer Count | 4 layers |
| Board Dimensions | 65mm x 65mm (1 PCS, ± 0.15mm) |
| Minimum Trace/Space | 7/8 mils |
| Minimum Hole Size | 0.5mm |
| Blind & Buried Vias | L1-L2, L2-L3 |
| Finished Board Thickness | 4.8mm |
| Finished Copper Weight | 1oz (1.4 mils) for inner and outer layers |
| Via Plating Thickness | 20 µm |
| Surface Finish | ENEPIG |
| Silkscreen | None on both sides |
| Solder Mask | None on both sides |
| Countersunk Holes | Yes |
| Electrical Testing | 100% before shipment |
PCB Stackup
| Layer | Details |
|---|---|
| Copper Layer 1 | 35 µm |
| RO4003C Core | 0.508 mm (20 mil) |
| Prepreg (RO4450F) | 0.203 mm (8 mil) |
| RO4003C Core | 1.524 mm (60 mil) |
| Copper Layer 2 | 35 µm |
| Prepreg (RO4450F) | 0.203 mm (8 mil) |
| RO4003C Core | 1.524 mm (60 mil) |
| Copper Layer 3 | 35 µm |
| Prepreg (RO4450F) | 0.203 mm (8 mil) |
| RO4003C Core | 0.508 mm (20 mil) |
| Copper Layer 4 | 35 µm |
PCB Statistics
Components: 6
Total Pads: 11
Thru Hole Pads: 5
Top SMT Pads: 6
Bottom SMT Pads: 0
Vias: 5
Nets: 4
Artwork and Standards
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
Applications
Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Applications
Radar Systems
Guidance Systems
Point-to-Point Digital Radio Antennas
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