Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | Tlf-35 |
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PCB Capability (TLF-35) | |
PCB Material: | Organic-ceramic, Woven glass reinforcement |
Designation: | TLF-35 |
Dielectric constant: | 3.5 |
Dissipation Factor | 0.0022 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
TLF-35A Typcial Value | |||||
Property | Test Method | Units | Value | Units | Value |
Dielectric Constant @ 1.9 GHz | IPC-TM650 2.5.5.5.1 Mod | 3.50 ±0.05 | 3.50 ±0.05 | ||
Dissipation Factor @ 1.9 GHz | IPC-TM650 2.5.5.5.1 Mod | 0.0016 | 0.0016 | ||
Dissipation Factor @ 10 GHz | IPC-TM650 2.5.5.5.1 Mod | 0.0022 | 0.0022 | ||
Water Absorption | IPC-TM 650 2.6.2.1 | % | 0.03 | % | 0.03 |
Peel Strength (1 oz. copper) | IPC-TM 650 2.4.8 | Lbs./linear inch | 10 | N/mm | 1.8 |
Volume Resistivity | IPC-TM 650 2.5.17.1 | Mohm·cm | 2.0 x 109 | Mohm·cm | 2.0 x 109 |
Surface Resistivity | IPC-TM 650 2.5.17.1 | Mohm | 3.0 x 108 | Mohm | 3.0 x 108 |
Flexural Strength Lengthwise | IPC-TM 650 650 2.4.4 | psi | 13000 | N/mm2 | 90 |
Flexural Strength Crosswise | IPC-TM 650 650 2.4.4 | psi | 13000 | N/mm2 | 90 |
Thermal Conductivity | IPC-TM 650 2.4.50 | W/m/K | 0.37 | W/m/K | 0.37 |
x-y CTE (50 ~ 150ºC) | IPC-TM 650 2.4.41 | ppm/ºC | 9-12 | ppm/ºC | 9-12 |
z CTE (50 ~ 150ºC) | IPC-TM 650 2.4.41 | ppm/ºC | 80 | ppm/ºC | 80 |
Flammability | UL-94 | V-0 | V-0 |