Rogers Rt/Duroid 6010 PCB Dk 10.2 with Immersion Gold for Satellite Communications Systems

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Rtduroid 6010
• Model NO.: BIC-092-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Rogers High Frequency PCB Built on RT/Duroid 6010 DK 10.2 50mil With Immersion Gold for Satellite Communications Systems
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Hi Guys,
Today we're going to talk about Rogers 6010 PCB.

Rogers RT/duroid 6010LM microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. It's available with a dielectric constant value of 10.2.

PCB Capability (RT/duroid 6010)

PCB Material:	Ceramic-PTFE composite
Designator:	RT/duroid 6010LM
Dielectric constant:	10.2  ±0.25 (process)
	10.7 (design)
Layer count:	1 Layer, 2 Layer
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	10mil (0.254mm), 25mil (0.635mm)
	50mil (1.27mm), 75mil (1.90mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP.

RT/duroid 6010LM microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods.   It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.

Features and Benefits

1. High dielectric constant for circuit size reduction

2. Low loss. Ideal for operating at X-bank or below

3. Low moisture absorption reducing effects of moisture on electrical loss

4. Low Z-axis expansion providing reliable PTH in multilayer boards

4. Tight DK and thickness control for repeatable circuit performance

The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.


Appendix: Properties of RT/duroid 6010LM laminates. 

RT/duroid 6010 Typical Value
Property	RT/duroid 6010	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	10.2±0.25	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign	10.7	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0023	Z		10 GHz/A	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-425	Z	ppm/ºC	-50ºC-170ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	5 x 10^5		Mohm.cm	A	IPC 2.5.17.1
Surface Resistivity	5 x 10^6		Mohm	A	IPC 2.5.17.1
Tensile Properties					ASTM D638 (0.1/min. strain rate)
Young's Modulus	931(135)        559(81)	X                           Y	MPa(kpsi)	A
Ultimate Stress	17(2.4)         13(1.9)	X                    Y	MPa(kpsi)	A
Ultimate Strain	9 to 15                   7 to 14	X                    Y	%	A
Compressive Properties					ASTM D695 (0.05/min. strain rate)
Young's Modulus	2144 (311)	Z	MPa(kpsi)	A
Ultimate Stress	47(6.9)	Z	MPa(kpsi)	A
Ultimate Strain	25	Z	%
Flexural Modulus	4364 (633)      3751 (544)	X	MPa(kpsi)	A	ASTM D790
Ultimate Stress	36 (5.2)               32 (4.4)	X                    Y	MPa(kpsi)	A
Deformation under load	0.26                     1.3	Z                    Z	%	24hr/50ºC/7MPa   24hr/150ºC/7MPa	ASTM D261
Moisture Absorption	0.01		%	D48/50ºC 0.050"(1.27mm) thick	IPC-TM-650 2.6.2.1
Thermal Conductivity	0.86		W/m/k	80ºC	ASTM C518
Coefficient of Thermal Expansion	24 24 47	X Y Z	ppm/ºC	23ºC/50% RH	IPC-TM-650 2.4.41
Td	500		ºC TGA		ASTM D3850
Density	3.1		g/cm^3		ASTM D792
Specific Heat	1.00(0.239)		j/g/k (BTU/ib/^OF)		Calculated
Copper Peel	12.3 (2.1)		pli (N/mm)	after solder float	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

Thank you for your reading and you're welcome to contact us for your PCB enquiries.