Tc600 Multilayer PCB Printed Circuit Board of Shenzhen PCB Custom

• Customization: Available
• Structure: Multilayer Rigid PCB
• Dielectric: Tc600
• Model NO.: BIC-195-V2.1
• Material: Ceramic Filled PTFE/Woven Fiberglass
• Application: Antennas
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.
• Laminate Thickness: 15mil 20mil 30mil 50mil 60mil
• Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB
• Solder Mask: Green, Black, Blue, Yellow, Red etc.
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description
Rogers (Arlon) TC600 PCB stands as a cutting - edge composite material, expertly crafted with woven fiberglass reinforcement and ceramic filling in a PTFE matrix. Engineered to be a game - changer, it offers unparalleled heat - transfer capabilities, boasting industry - leading thermal conductivity. TC600 PCB not only allows for superior power management but also eliminates overheating issues, significantly enhancing the reliability of electronic devices.

One of its most notable features is the remarkable reduction in dielectric and insertion losses. This translates into higher gains and efficiencies for amplifiers and antennas, ensuring optimal performance in signal transmission. The material's stable dielectric constant across an extensive temperature range from - 40°C to 140°C (with a coefficient of - 75 ppm/°C) is a major advantage. Rogers TC600 laminate empowers power amplifier and antenna designers to maintain peak performance, preventing bandwidth losses that typically occur due to dielectric constant fluctuations with temperature changes.

Moreover, Rogers TC600 PCB's low Z - direction coefficient of thermal expansion (CTE) and enhanced mechanical strength make it a top choice in the 6.15 dielectric constant market. TC600 laminate combines exceptional thermal, electrical, and mechanical properties, setting a new standard for high - performance composite materials in a wide array of applications.
 

 

Features
1. Very Low Loss Tangent (0.002 at 10 GHz) provides Higher Amplifier or Antenna Efficiency
2. Mechanically Robustness improves processing and reliability, replaces brittle laminates that cannot withstand processing, impact or High Gain forces
3. Low coefficient of thermal expansion on X,Y and Z axis (9, 9 and 35 ppm/°C) matches active components for low stress solder joints
4. High Peel Strength for Reliable narrow lines
 

Benefits
1. Reduced Heat Generated through Transmission Line Loss
2. Heat Dissipation and Management
3. Replace Ceramic in Some Applications
4. Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs

Our PCB Capability (TC600

PCB Capability (TC600)
PCB Material:	Ceramic Filled PTFE/Woven Fiberglass
Designation:	TC600
Dielectric constant:	6.15  (10 GHz)
Dissipation Factor	0.002 (10 GHz)
Layer count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness:	10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, Immersion gold, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold plated etc..

 

Typical Applications:
1. Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
2. GPS & Hand-held RFID Reader Antennas
3. Microwave Combiner and Power Divider Boards in Avionics Applications
4. Power Amplifiers, Filters and Couplers
5. Small Footprint Antennas

Appendix: Typical Properties TC600

Property	Unit	Value	Test Method
1. Electrical Properties
Dielectric Constant (may vary by thickness)
@1.8 MHz	-	6.15	Resonant Cavity
@10 GHz	-	6.15	IPC TM-650 2.5.5.5
Dissipation Factor
@1.8 GHz	-	0.0017	Resonant Cavity
@10 GHz	-	0.002	IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric	-
TCεr @ 10 GHz (-40-150°C)	ppm/ºC	-75	IPC TM-650 2.5.5.5
Volume Resistivity
C96/35/90	MΩ-cm	1.6x109	IPC TM-650 2.5.17.1
E24/125	MΩ-cm	2.4x108	IPC TM-650 2.5.17.1
Surface Resistivity
C96/35/90	MΩ	3.1x109	IPC TM-650 2.5.17.1
E24/125	MΩ	9.0x108	IPC TM-650 2.5.17.1
Electrical Strength	Volts/mil (kV/mm)	850 (34)	IPC TM-650 2.5.6.2
Dielectric Breakdown	kV	62	IPC TM-650 2.5.6
Arc Resistance	sec	>240	IPC TM-650 2.5.1
2. Thermal Properties
Decomposition Temperature (Td)
Initial	°C	512	IPC TM-650 2.4.24.6
5%	°C	572	IPC TM-650 2.4.24.6
T260	min	>60	IPC TM-650 2.4.24.1
T288	min	>60	IPC TM-650 2.4.24.1
T300	min	>60	IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC	ppm/ºC	9, 9	IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC	ppm/ºC	35	IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC)	%	1.5	IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress	lb/in (N/mm)	10 (1.8)	IPC TM-650 2.4.8
At Elevated Temperatures (150ºC)	lb/in (N/mm)	10 (1.8)	IPC TM-650 2.4.8.2
After Process Solutions	lb/in (N/mm)	9 (1.6)	IPC TM-650 2.4.8
Young's Modulus	kpsi (MPa)	280 (1930)	IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross)	kpsi (MPa)	9.60/9.30 (66/64)	IPC TM-650 2.4.4
Tensile Strength (Machine/Cross)	kpsi (MPa)	5.0/4.30 (34/30)	IPC TM-650 2.4.18.3
Compressive Modulus	kpsi (MPa)		ASTM D-3410
Poisson's Ratio	-		ASTM D-3039
4. Physical Properties
Water Absorption	%	0.02	IPC TM-650 2.6.2.1
Density, ambient 23ºC	g/cm3	2.9	ASTM D792 Method A
Thermal Conductivity (z-axis)	W/mK	1.1	ASTM E1461
Thermal Conductivity (x, y)	W/mK	1.4	ASTM E1461
Specific Heat	J/gK	0.94	ASTM E1461
Flammability	class	V0	UL-94
NASA Outgassing, 125ºC, ≤10-6 torr
Total Mass Loss	%	0.02	NASA SP-R-0022A
Collected Volatiles	%	0	NASA SP-R-0022A
Water Vapor Recovered	%	0	NASA SP-R-0022A