Brief Introduction
With the development of electronic communication technology, the communication frequency
is becoming higher and higher, and the high frequency signal transmission, need to use low
dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. These materials
have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based materials
(PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic). Usually these
materials are expensive.
Reducing the cost is an important means for customers to improve the competitiveness of products.
Therefore, the customers adopt the laminated structure of mixed materials in the design of PCB
structure, that is, the necessary signal layer uses high-frequency materials to meet the needs of
signal transmission. Other line layers are made of conventional fiberglass epoxy FR-4, which we
call a hybrid board.
Available high frequency material (Core)
RO4350B RO4003C
4mil (0.1mm) 8mil (0.203mm)
6.6mil (0.168mm) 12mil (0.3mm)
10mil (0.254mm) 20mil (0.508mm)
13.3mil (0.338mm) 32mil (0.813mm)
20mil (0.508mm) 60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)
PCB Case: 4 Layer Hybrid PCB on RO4003C 12 mil and
FR-4 20 mil Combined
(Printed circuit boards are custom-made products, the picture and parameters shown are just
for reference)
General description
This is a type of hybrid high frequency PCB built on RO4003C and FR-4 combined for the application
of digital transimitter. It's a 4 layer RF PCB board at 1.2 mm thick. It's immersion gold finish with green
solder mask and white silkscreen. It's fabricated per IPC 6012 Class 2 using supplied Gerber data.
Each 10 boards are packed for shipment.
Features and benefits
RO4003C exhibit a stable dielectric constant over a broad frequency range. This makes it an
ideal substrate for broadband applications.
Excellent high frequency performance due to low dielectric tolerance and loss.
Excellent dimensional stability.
ENIG has good oxidation resistance and good heat dissipation.
Comprehensive equipment management and maintenance and process control,
High voltage test, Impedance control test, micro-section, solder-ability test,
Small quantity order is accepted
Delivery on time: >98%
UL conformed
Application
Modular oscilloscope, Antenna combiner, Balanced amplifier, 3G antenna
Parameter and data sheet
PCB SIZE |
183x 115mm=1PCS |
BOARD TYPE |
|
Number of Layers |
Multilayer PCB |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 17um(0.5oz)+plate TOP layer |
RO4003C 12mil Er 3.38 |
copper ------- 18um(0.5oz) MidLayer 1 |
FR-4 0.5mm |
copper ------- 18um(0.5oz) MidLayer 2 |
RO4003C 12mil Er 3.38 |
copper ------- 17um(0.5oz)+plate BOT Layer |
TECHNOLOGY |
|
Minimum Trace and Space: |
5.5mil/4.9mil |
Minimum / Maximum Holes: |
0.3/6.4mm |
Number of Different Holes: |
6 |
Number of Drill Holes: |
951 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control |
NO |
BOARD MATERIAL |
|
Glass Epoxy: |
RO4003C 12mil mixed with FR-4 0.5mm |
Final foil external: |
1oz |
Final foil internal: |
0.5oz |
Final height of PCB: |
1.2 mm ±10% |
PLATING AND COATING |
|
Surface Finish |
Electroless nickel over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickel) |
Solder Mask Apply To: |
Top and Bottom, 12micon Minimum. |
Solder Mask Color: |
Green, PSR-2000GT600D, Taiyo supplied. |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
TOP |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo Supplied. |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged
FREE AREA |
VIA |
Plated Through Hole(PTH), Via tented |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" (0.15mm) |
Board plating: |
0.0030" (0.076mm) |
Drill tolerance: |
0.002" (0.05mm) |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
About us
Based in China, Bicheng PCB adheres to the philosophy of helping small and medium sized
companies reduce their cost and time spent on PCB. We provide a variety of PCB products
to meet the demands.
Our Driving Circuit Boards Capabilities 2019
Blind vias, Buried vias
Flex PCB
Heavy Copper Boards 12oz
High Tg, High CTI Material
Hybrid FR-4 and High Frequency Material
Impedance Controlled PCB
IPC Class 2, IPC Class 3
Lead Free PCB (RoHS Compliant)
Multilayer PCBs to 32+ copper layers boards
Metal Core PCB (MCPCB)
PCB Materials - FR-4, Polyimide, Rogers & More
RoHS Compliant PCB Manufacturer
Rigid Flex PCB
RF PCB / High Frequency PCB
Through-hole, BGA, Gold Finger, Edge dome
Via-in-pad, Filled vias
TS16949 (2009), ISO14001 (2004), ISO9001 (2008), UL certified
Our Services
Focus on Prototypes, Small Batches, Volume Production
Quick turn-around, double sided PCB 24 hours available.
Door to door shipment service
Our Clients are located worldwide.
Australia: Perth, Melbourne, New South Wales, South Australia, West Australia
Austria: Breitenfurt bei Wien, Graz
Bangladesh: Purana Paltan
Belgium: Deinze, Hasselt
Bulgaria: Plovdiv
Brazil: Caxias do Sul
Canada: Quebec, Ontario, Vancouver
Czech: Pardubice, Horní Pocernice
France: Villeneuve La Garenne Cedex, Montchenu
Germany: Stuttgart, Garbsen, Hamburg, Altenburg, Velbert Kleinmachnow, Potsdam
Hungary: Budapest
India: Tamilnadu
Ireland: Cork
Israel: Nettanya City, Ben-Gurion Airport, Tel Aviv, Yahud, Acre,
Italy: Peschiera Borromeo, Verona, Mezzocorona, Pietrasanta Lucca, Torino
Kuwait: Safat
Malta: Mosta
Malaysia: Selangor
Mexico: Leon Guanajuato
Portugal: Guimaraes
South Korea: Gyeonggi-DO
Serbia: Kragujevac
Sweden: Goteborg, Siljansns,
Thailand: Bangkok, Chonburi
Turkey: Ankara, Istanbul, Kocaeli
The Netherlands: Diemen
UK: Bristol, Surrey
Ukraine: Kiev
USA: Connecticut, Alaska, New York City, Miami,, New Jersey, Texas, Colorado, Largo,
California, Candler
Vietnam: HoChiMinh City
Zambia: Kitwe
Variety of PCBs
Hole verifier