PCB Circuit of Shenzhen PCB Power Amplifier Board

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: Tlx-7
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  • PCB Circuit of Shenzhen PCB Power Amplifier Board
  • PCB Circuit of Shenzhen PCB Power Amplifier Board
  • PCB Circuit of Shenzhen PCB Power Amplifier Board
  • PCB Circuit of Shenzhen PCB Power Amplifier Board
  • PCB Circuit of Shenzhen PCB Power Amplifier Board
  • PCB Circuit of Shenzhen PCB Power Amplifier Board
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Basic Info.

Model NO.
BIC-1155-V2.1
Material
PTFE Fiberglass Laminate
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Model
PCB
Brand
Taconic
Surface Finish
Immersion Gold
Board Thickness
0.6mm (Finished)
Layer Count
2-Layer
Solder Mask
None
Transport Package
Kk Paper, 3-Layer Wrinkle
Specification
91mm x 75mm (± 0.15mm)
Trademark
Bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

Taconic TLX-7 High Frequency PCB 2-Layer 0.6mm RF PCB with Immersion Silver

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 

1. Overview of TLX-7 PCB

This precision-engineered 2-layer rigid PCB utilizes Taconic TLX-7-a PTFE fiberglass laminate designed for extreme-environment RF/microwave applications. Featuring an ultra-slim 0.6mm profile and immersion silver finish, it delivers exceptional signal integrity for high-frequency designs. Manufactured to IPC-Class-2 standards with 100% electrical testing, this board guarantees reliability in aerospace, defense, and 5G systems.
Taconic TLX-7 PCB provides unparalleled resistance to vibration, radiation, and thermal stress while maintaining ultra-low PIM (< -160 dBc).
 
PCB Circuit of Shenzhen PCB Power Amplifier Board
PCB Circuit of Shenzhen PCB Power Amplifier Board
 

2. PCB Construction Details 

Parameter Specification
Base Material Taconic TLX-7
Layer Count 2 Layers
Board Dimensions 91mm x 75mm (±0.15mm)
Finished Thickness 0.6mm
Copper Weight (Outer) 1oz (35μm)
Min Trace/Space 4/5 mils
Min Hole Size 0.3mm
Via Plating Thickness 20μm
Surface Finish Immersion Silver
Blind Vias None
Solder Mask/Silkscreen None (Top/Bottom)
Electrical Test 100% Pre-Shipment

3. Additional Key Components & Features
Stackup Architecture:
Layer 1: Copper (35μm)
Core: TLX-7 Dielectric (0.508mm)
Layer 2: Copper (35μm)

This symmetric stackup delivers exceptional impedance control and signal integrity for RF transmission lines, minimizing insertion loss in microwave circuits.

 PCB Statistics:
    Components:        15
    Total Pads:         63
    Thru Hole Pads:     37
    Top SMT Pads:      26
    Bottom SMT Pads:    0
    Vias:              43
    Nets:              4

Quality & Supply Specifications:
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 Certified
Global Availability: Worldwide Shipping
Testing Protocol: 100% Electrical Testing

 

Material Advantages:
Electrical Excellence: Ultra-stable Dk (2.6±0.04 @10GHz), record-low Df (0.0014 @1.9GHz), and consistent PIM performance (<-160dBc).

Extreme Durability: UL 94 V0 flammability rating, near-zero moisture absorption (<0.02%), CTE stability (X/Y: 21-23 ppm/°C), and NASA-grade outgassing (TML: 0.02%, CVCM: 0%).

Environmental Resistance: Survives space radiation, seawater corrosion, launch vibration (PIM<-160dBc), and thermal extremes (-40°C to 260°C).



 
PCB Circuit of Shenzhen PCB Power Amplifier Board


Typical Applications:
Radar/altimeter systems for missiles and aircraft
Satellite communications and space probes
5G massive MIMO antennas and base stations
RF test equipment and microwave amplifiers
Warship antenna arrays and combiners
 

PCB Circuit of Shenzhen PCB Power Amplifier Board
PCB Circuit of Shenzhen PCB Power Amplifier Board

Why Choose This PCB?
Engineered for mission-critical RF designs, this 2-layer PCB leverages a TLX-7 PTFE core with ultra-low loss properties essential for microwave circuits. Key differentiators include: 0.6mm thin profile for compact assemblies, radiation-resistant substrate for space applications, NASA-compliant outgassing, military-grade vibration resistance, and low CTE stability (21-23 ppm/°C). Its symmetric copper-clad stackup ensures precise impedance control for 5G infrastructureaerospace electronics, and defense systems requiring millimeter-wave performance.


Tags:mission-critical RF designs, 2-layer PCB, TLX-7 PCB, ultra-low loss properties, microwave circuits, 0.6mm thin profile, radiation-resistant substrate, space-grade reliability, immersion silver finish, high-frequency performance, NASA-compliant outgassing, vibration resistance, low CTE stability
 

Order Now for Space-Grade RF Solutions!

Integrate this NASA-qualified PCB into your critical communications or radar systems today. Request instant quotes for IPC-Class-2 certified boards with global delivery.


 

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