Tc600 High-Frequency PCB: The Ultimate Solution for Demanding RF Power Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Tc600
• Model NO.: BIC-1119-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

TC600 High-Frequency PCB: The Ultimate Solution for Demanding RF Power Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


Introduction
In today's rapidly evolving RF and microwave industry, engineers and designers require PCBs that deliver exceptional thermal management, low signal loss, and mechanical robustness-all while maintaining cost efficiency. The Rogers TC600-based 2-layer PCB is engineered precisely for these high-power applications, offering "Best-in-Class" thermal conductivity (1.1 W/m·K) and ultra-low dissipation factor (0.0017-0.0020).

At Bicheng Technologies, we specialize in manufacturing high-performance RF PCBs that meet the stringent demands of avionics, satellite communications, and military-grade systems. This article explores the technical advantages, applications, and unique benefits of our TC600 2-layer PCB, ensuring you make an informed decision for your next high-power RF project.


1. Why TC600? Key Features & Benefits

A. Unmatched Thermal Performance
1.1 W/m·K thermal conductivity - Far superior to standard PTFE materials, ensuring efficient heat dissipation in high-power amplifiers and combiners.

Low thermal coefficient of Dk (-75 ppm/°C) - Maintains stable electrical performance across a wide temperature range (-40°C to +150°C).


B. Superior Electrical Properties
Dielectric Constant (Dk) = 6.15 - Consistent from 1.8 MHz to 10 GHz, making it ideal for broadband applications.

Ultra-low loss tangent (0.0017 @1.8 GHz, 0.0020 @10 GHz) - Enhances signal integrity and amplifier efficiency.


C. Mechanical Durability & Reliability
Excellent CTE stability (9 ppm/°C in X/Y, 35 ppm/°C in Z) - Minimizes warping and ensures long-term reliability.

High peel strength - Supports fine-line circuitry without delamination.

0.03% moisture absorption - Ideal for harsh environments.


D. Cost-Effective Manufacturing
Easier to drill and process compared to alumina-filled laminates, reducing fabrication costs.

Compatible with standard FR-4 processes, ensuring faster turnaround times.


2. PCB Construction & Specifications
A. Board Configuration

Parameter	Specification
Base Material	Rogers TC600 (woven fiberglass + ceramic-filled PTFE)
Layer Count	2-layer rigid PCB
Board Dimensions	141.5mm × 163mm (4 panels per set)
Finished Thickness	1.6mm (1.524mm core + 2×35µm Cu)
Copper Weight	1oz (35µm) outer layers
Minimum Trace/Space	6/4 mils
Minimum Hole Size	0.5mm (filled and capped)
Via Plating Thickness	20µm
Surface Finish	Immersion Gold (ENIG)
Solder Mask	Top: Green; Bottom: None
Silkscreen	None
Quality Standard	IPC-Class-2

B. Stackup Structure
Top Layer: 35µm copper + ENIG finish (green solder mask)

Core: 1.524mm TC600 dielectric

Bottom Layer: 35µm copper (bare for optimal thermal dissipation)


C. Design & Assembly Support
Components Supported: 35 (86 SMT, 67 thru-hole)

Interconnects: 124 vias (0.5mm, filled & capped for reliability)

Signal Paths: 7 controlled impedance nets

Artwork Format: Gerber RS-274-X


3. Ideal Applications

A. Power Amplifiers & RF Combiner Circuits
High-power RF amplifiers benefit from TC600's thermal conductivity and low loss, ensuring stable performance under heavy loads.

Microwave combiners/dividers require consistent Dk, which TC600 delivers across frequencies.


B. Avionics & Defense Systems
Aircraft radar and communication systems demand mechanical robustness-TC600 withstands high G-forces and vibration.

Military-grade filters and couplers rely on low-loss signal integrity.


C. Satellite & Wireless Communications
GPS, DAB (Digital Audio Broadcasting), and RFID antennas require stable Dk and low moisture absorption.

Small-footprint antennas benefit from TC600's high peel strength for fine-line circuitry.


4. Why Choose Bicheng Technologies?

A. Expertise in High-Frequency PCBs
20+ years of RF PCB manufacturing

ITAR-compliant production for defense applications

Full impedance control & signal integrity analysis


B. Fast & Reliable Production
Prototypes in 10 days, volume production in 3 weeks

100% electrical testing before shipment


C. Global Support & Customization
Custom stackup optimization for your application

Thermal simulation reports available


5. Conclusion
The Rogers TC600 2-layer PCB is a game-changer for high-power RF applications, offering unparalleled thermal management, low loss, and mechanical durability. Whether you're designing avionics systems, power amplifiers, or satellite antennas, this material ensures reliability and performance in the most demanding environments.

Ready to integrate TC600 into your next project?
Contact Sally for technical consultation or to request DfM guidelines. Prototype lead times as fast as 5 business days available.


SEO Keywords:
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This article ensures engineers and procurement managers understand the full capabilities of TC600 PCBs while optimizing for search visibility in the RF and microwave industry. 


Thank you for your reading and you're welcome to contact us for your PCB enquiries.