8-Layer 370hr PCB, 1.0mm Thick High-Tg Fr-4 with Impedance Controlled and Immersion Gold Finish, Caf-Resistant Boa

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: 370hr
• Model NO.: BIC-1121-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Brand: Rogers/Taconic/Wangling
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

8-Layer 370HR PCB - 1.0mm Thick, 4/4 Mils Trace/Space, Impedance Controlled
(All PCBs are custom-manufactured. Parameters may vary based on design requirements.)


1. Overview of This PCB
This 8-layer rigid PCB utilizes Isola 370HR high-Tg FR-4 material, engineered for applications demanding superior thermal reliability and signal integrity. Designed for computing, networking, automotive, and industrial electronics, it combines CAF resistance, low CTE, and FR-4 process compatibility with advanced features like 50Ω impedance control and 4/4 mils fine-line routing. Certified to IPC-Class-2 and UL/RoHS compliant, this board is ideal for high-density, high-reliability designs.

Key Benefits:
Thermal Resilience: Tg 180°C, Td 340°C, and T288 30 minutes for lead-free reflow endurance.

Signal Integrity: 50Ω impedance control on critical layers (11mil traces).

Manufacturing Precision: 4/4 mils trace/space, 0.2mm minimum hole size, and 100% electrical testing.

Global Scalability: Prototypes to mass production with fast turnaround.


2. PCB Construction Details

Parameter	Specification
Base Material	Isola 370HR (Tg 180°C)
Layer Count	8 layers
Board Dimensions	122.87mm x 148.5mm (4-up panel)
Thickness	1.0mm ±10%
Copper Weight	1oz inner/outer layers
Min Trace/Space	4/4 mils
Min Hole Size	0.2mm (mechanical)
Surface Finish	Immersion Au (4μ")
Solder Mask	Green (top/bottom)
Silkscreen	White (top/bottom)
Plating Thickness	20μm via walls
Testing	100% electrical test

3. PCB Stackup (8-Layer)

Signal	L1	Top	1.4mil
	Prepreg		4
Plane	L2	GND	1.4mil
	HR370 Core	4
Signal	L3	SIG1	1.4mil
	Prepreg		4
Plane	L4	PWR	1.4mil
	HR370 Core	5
Plane	L5	GND2	1.4mil
	Prepreg		4
Signal	L6	SIG2	1.4mil
	HR370 Core	4
Plane	L7	PWR2	1.4mil
	Prepreg		4
Signal	L8	Bottom	1.4mil

4. Design & Manufacturing Specifications

Components: 71 total (65 thru-hole, 51 top SMT).

Pads/Vias: 116 pads, 152 vias, 7 nets.

Artwork Files: Gerber RS-274-X format.

Quality Standard: IPC-Class-2.


5. 370HR Material Advantages
Features:

CAF Resistance: Enhanced reliability for high-voltage designs.

Thermal Performance: T260 60 minutes, T288 30 minutes.

RoHS/UL Certified: Safe for lead-free and halogen-free assembly.

HDI-Compatible: Supports advanced packaging technologies.


Typical Applications:

Data Centers: Servers, storage, and networking PCBs.

Automotive: ECUs, infotainment, ADAS.

Medical: Diagnostic equipment, imaging systems.

Industrial IoT: High-temperature sensors, control modules.


Why Choose This PCB?

High-Density Routing: 4/4 mils trace/space for complex layouts.

Controlled Impedance: 50Ω top-layer traces for RF-critical signals.

Robust Thermal Profile: Withstands multiple reflows and harsh environments.

Cost-Effective: FR-4 process compatibility reduces fabrication costs.


Order Now for Reliable Multilayer Performance!
Contact us to customize your stackup or request a quote for fast global delivery. Ideal for engineers prioritizing thermal stability and signal integrity in mission-critical applications.



Thank you for your reading and you're welcome to contact us for your PCB enquiries.