Rogers Ad250c Supplier PTFE Laminate Ad250c 2-Layer RF Board for Low-Pim Antenna PCB with HASL Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Ad250c
• Model NO.: BIC-1122-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

AD250C Double-Sided PCB - 1.6mm Thick, 6/6 Mils Trace/Space, Low-PIM Antenna Board
(Custom-manufactured to your design requirements. Specifications may vary.)


1. Overview of This PCB
This 2-layer rigid PCB utilizes Rogers AD250C laminate, a cost-effective PTFE-based material engineered for high-frequency antenna systems and telecommunication infrastructure. With a low dielectric constant (2.50 ±0.05) and ultra-low loss tangent (0.0013 @ 10GHz), it delivers exceptional RF performance for cellular base stations, automotive telematics, and satellite antennas. The board features HASL surface finish, 1oz copper layers, and 100% electrical testing for reliability.

Key Benefits:
RF-Optimized: Low PIM (-159 dBc) and stable Dk for antenna efficiency.

Thermal Resilience: Decomposition temperature >500°C.

Manufacturing Simplicity: 6/6 mils trace/space, 0.4mm min holes, no solder mask/silkscreen.

Global Availability: Prototypes to production with IPC-Class-2 compliance.


2. PCB Construction Details

Parameter	Specification
Base Material	Rogers AD250C (PTFE + ceramic)
Layer Count	2 layers
Board Dimensions	355mm x 210mm (1-up)
Thickness	1.6mm (60mil core)
Copper Weight	1oz outer layers (35µm)
Min Trace/Space	6/6 mils
Min Hole Size	0.4mm (mechanical)
Surface Finish	HASL (Hot Air Solder Leveling)
Solder Mask	None (bare copper)
Silkscreen	None
Plating Thickness	20μm via walls
Testing	100% electrical test

3. PCB Stackup (2-Layer)

Layer	Material	Thickness
Copper (Top)	1oz (35µm)	-
Dielectric	AD250C core	1.524mm (60mil)
Copper (Bottom)	1oz (35µm)	-

4. Design & Manufacturing Specifications

Components: 118 total (118 thru-hole, 142 top SMT).

Pads/Vias: 260 pads, 161 vias, 3 nets.

Artwork Files: Gerber RS-274-X format.

Quality Standard: IPC-Class-2.


5. AD250C Material Advantages
Features:

Low Loss Tangent: 0.0013 @ 10GHz for minimal signal degradation.

PIM Performance: -159 dBc (critical for antenna arrays).

Moisture Resistance: 0.04% absorption for stable operation.

CTE Stability: X/Y/Z: 47/29/196 ppm/°C (balanced for PTH reliability).


Benefits:

Ceramic-Filled PTFE: Combines FR-4-like manufacturability with RF performance.

Dimensional Stability: Tight Dk tolerance (±0.05) for repeatable designs.

High-Temperature Endurance: Suitable for harsh environments.



Typical Applications:

5G/4G Base Stations: Antenna feed networks, power dividers.

Automotive Radar: Telematics, V2X communication.

Satellite Systems: LNB modules, broadcast antennas.


Why Choose This PCB?

Antenna-Grade Performance: Optimized for low PIM and high efficiency.

Simplified Assembly: No solder mask/silkscreen reduces parasitic effects.

Cost-Effective: AD250C balances PTFE performance with competitive pricing.


Order Now for High-Frequency Antenna Solutions!
Contact us to customize your design or request a quote for fast global delivery. Ideal for engineers prioritizing signal integrity and PIM performance in wireless systems.



Thank you for your reading and you're welcome to contact us for your PCB enquiries.