Tly-5z Ultra-Lightweight RF PCB: Advanced 2-Layer Solution for Demanding Aerospace Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Tly-5z
• Model NO.: BIC-1120-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

TLY-5Z Ultra-Lightweight RF Circuit Board: Advanced 2-Layer Solution for Demanding Aerospace Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


Innovative PCB Technology for Next-Generation Wireless Systems
In the rapidly evolving aerospace and defense sectors, engineers face mounting pressure to develop high-performance RF circuits that deliver exceptional signal integrity while minimizing weight. The Taconic TLY-5Z laminate represents a breakthrough in PCB materials technology, combining ultra-low density (1.92 g/cm³) with outstanding high-frequency characteristics - making it the premier choice for weight-sensitive RF applications.

At Bicheng Technologies, we've refined our manufacturing processes to produce precision TLY-5Z circuit boards that meet the exacting standards of satellite communications, aircraft avionics, and military radar systems. This comprehensive guide explores the unique advantages, technical specifications, and real-world applications of our 2-layer TLY-5Z PCB solution.


1. Unparalleled Material Advantages

A. Revolutionary Lightweight Construction
30% lighter than conventional RF substrates - Ideal for UAVs and spacecraft where every gram counts

Woven fiberglass reinforcement prevents dimensional instability common in pure PTFE boards

Optimized Z-axis CTE (130 ppm/°C) dramatically improves plated through-hole reliability


B. Best-in-Class RF Performance
Exceptionally stable dielectric constant (2.20±0.04) maintains consistency across frequency bands

Industry-leading loss characteristics (0.0015 @10GHz) maximize amplifier efficiency

-72 ppm/°C thermal coefficient ensures stable operation from -55°C to +150°C


C. Enhanced Manufacturing Benefits
Superior peel strength enables reliable fine-line circuitry

Compatible with standard FR-4 processing - No exotic fabrication techniques required

Moisture resistance (0.03% absorption) prevents performance degradation in humid environments


2. Precision Engineering Specifications
A. Board Configuration Details

Critical Parameter	Engineering Specification
Core Material	Taconic TLY-5Z reinforced PTFE
Layer Architecture	Symmetrical 2-layer construction
Physical Dimensions	145.0 × 90.0 mm (±0.15mm)
Total Thickness	0.8 mm (30mil core + 35μm Cu)
Conductor Thickness	1 oz (35μm) electrodeposited copper
Circuit Density	6/8 mil trace/space capability
Minimum Aperture	0.3 mm drilled holes
Surface Treatment	Electroless nickel/immersion gold (ENIG)
Protective Coating	Blue solder mask (top side only)
Component Markings	White silkscreen (top side)
Quality Certification	IPC-Class-2 with 100% electrical test

B. Optimized Layer Structure
Surface Layer: 35μm copper with ENIG finish (blue solder mask/white markings)

Dielectric Core: 0.762mm TLY-5Z substrate (Dk=2.20)

Base Layer: 35μm copper (unmasked for optimal RF performance)


C. Advanced Design Capabilities
Component Integration: Supports 17 devices (47 SMT/36 thru-hole terminations)

Interconnect Solution: 66 precision vias (0.3mm minimum)

Signal Management: 5 independent conduction paths

Manufacturing Compatibility: Gerber RS-274X file format


3. Mission-Critical Applications

A. Aerospace Communication Systems
Low-mass phased array antennas for next-generation aircraft

Satellite transceiver modules requiring stable RF performance in orbit


B. Defense Electronics
Lightweight EW (Electronic Warfare) payloads

Portable field communication equipment


C. Commercial Wireless Infrastructure
High-efficiency base station antennas

Low-loss RF filters for 5G networks


4. Competitive Advantages

A. Unmatched Technical Expertise
20+ years specializing in aerospace-grade PCBs

ITAR-registered manufacturing facility

Advanced signal integrity analysis capabilities


B. Reliable Production Ecosystem

10-day standard prototype lead time

Military-grade quality assurance protocols

Global logistics network with DHL/FedEx partnerships


C. Value-Added Engineering Services
Custom stackup optimization

Thermal modeling and mechanical stress analysis

Impedance-controlled design consultation


5. Implementation Guide
For optimal results with TLY-5Z boards:

Leverage the material's low loss characteristics for sensitive RF front-ends

Utilize the stable Dk for precise impedance control in antenna designs

Take advantage of the lightweight properties in portable/wearable applications

Implement proper thermal management for high-power scenarios


6. Conclusion & Next Steps
The Taconic TLY-5Z 2-layer PCB redefines performance standards for weight-constrained, high-frequency applications. By combining aerospace-grade material properties with precision manufacturing, we deliver solutions that outperform conventional RF substrates in every critical parameter.


Accelerate your next aerospace RF project:
Contact Sally for technical consultation or to request DfM guidelines. Prototype lead times as fast as 5 business days available.


Technical Keywords for Search Optimization:
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This authoritative resource provides engineering teams with comprehensive technical data and application insights while optimizing for discoverability in specialized RF component searches.





Thank you for your reading and you're welcome to contact us for your PCB enquiries.