| Customization: | Available |
|---|---|
| Type: | Flexible Circuit Board |
| Dielectric: | Polyimide |
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(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
Our green flexible printed circuits (FPCs) are expertly crafted from high-quality polyimide material, specifically designed for gigabyte switch applications. Featuring a two-layer structure with a thickness of 0.25mm, these FPCs incorporate a partial green solder mask in the center of the chip area. Manufactured by Shengyi, our products meet IPC 6012 Class 2 standards using the supplied Gerber data. Additionally, FR-4 stiffeners are securely bonded on both the inserting head and bottom side for enhanced stability.
Key Features and Benefits
1.Exceptional Flexibility: Adaptable design that meets various application needs.
2.Volume Reduction: Optimized for compact installations.
3.Lightweight Design: Minimizes overall system weight.
4.Assembly Consistency: Ensures uniform quality and performance.
5.Enhanced Reliability: Built to withstand demanding environments.
6.Material Options: Choose from a range of materials to suit your project.
7.Cost-Effective Solutions: Competitive pricing without sacrificing quality.
8.Process Continuity: Streamlined manufacturing for efficient production.
9.Outstanding Customer Service: Committed to on-time delivery with a 98% success rate.
Parameter and Data Sheet
| Size of Flexible PCB | 75.22 X 31.17mm |
| Number of Layers | 2 |
| Board Type | Flexible PCB |
| Board Thickness | 0.25mm |
| Board Material | PET 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60ºC |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 70um |
| Coverlay Colour | Black / Green solder mask |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | FR-4 / Polyimide |
| Stiffener Thickness | 0.4mm /0.2mm |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Applications
Our green FPCs are versatile and suitable for a variety of applications, including:
Toy lamp strips
Industrial control audio equipmentB
Tablet PC module soft boards
Covercoat / Solder Mask
The solder mask used in our flexible PCBs differs from traditional rigid boards. We utilize a polyimide film that is coated on one side with a semi-cured, non-tacky adhesive-referred to as covercoat in flexible circuits. This covercoat is laminated to encapsulate the copper pattern, leaving solder pads exposed through access holes.
To ensure optimal performance, the covercoat production sheet is cut slightly smaller than the flexible circuit sheet, preventing premature edge sealing and air bubble trapping. Access holes are typically drilled, but for high-volume production, punching offers a more cost-effective solution.
When drilling the covercoat, we stack multiple sheets, adjusting parameters to accommodate the unique properties of polyimide material. It's essential to consider dimensional changes in the flexible circuit sheets, which can vary by up to 0.2%.
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