General Profile
Metal core PCB is thermal management circuit board used in LED lighting which needs fast cooling dissipation. The metal core can be aluminum (aluminum core PCB) and copper (copper core PCB), even iron base. The fastest speed of heat transfer is on copper which is designed in the form of thermoelectric separation.
Advantages
1) Effective heat dissipation reduces the operating temperature of the module and prolongs the service life;
2) Power density and reliability are improved up 10%;
3) Reduce the dependence of heat sinks and other hardware (including thermal interface materials);
4) Reduce the volume of the product;
5) Reduce the cost of hardware and assembly;
6) Optimization combination of power circuit and control circuit;
7) Replace the fragile ceramic substrate and obtain a better mechanical durability;
8) Reduce the operating temperature of the equipment;
Applications
LED lighting, Switch regulator, DC/AC converter, Communication electronic equipment, A filter electric circuit, Office automation equipment, Motor driver, Motor controller, Automobile etc.
Metal Core PCB Capability 2018
| NO. |
Parameter |
Value |
| 1 |
Type of Metal Core |
Aluminum, Copper, Iron |
| 2 |
Model of Metal Core |
A1100, A5052, A6061, A6063, C1100 |
| 3 |
Surface Finish |
HASL, Immersion Gold, Immersion Silver, OSP |
| 4 |
Thickness of Surface plating |
HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm |
| 5 |
Layer Count |
1-4 Layers |
| 6 |
Maximum of Board Size |
23" x 46" (584mm×1168mm) |
| 7 |
Mininum of Board Size |
0.1969" x 0.1969" (5mm×5mm) |
| 8 |
Board Thickness |
0.0157" x 0.2362" (0.4-6.0mm) |
| 9 |
Copper Thickness |
0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) to 10oz (350µm) |
| 10 |
Minimum Track Width |
5mil (0.127mm) |
| 11 |
Minimum Space |
5mil (0.127mm) |
| 12 |
Minimum Hole Size |
0.0197" (0.5mm) |
| 13 |
Maximum Hole Size |
No limit |
| 14 |
Minimum Holes Punched |
PCB thickness <1.0mm: 0.0394" (1.0mm) |
| PCB thikness 1.2-3.0mm: 0.0591" (1.5mm) |
| 15 |
PTH Wall Thickness |
>20µm |
| 16 |
Tolerance of PTH |
±0.00295" (0.075mm) |
| 17 |
Tolerance of NPTH |
±0.00197" (0.05mm) |
| 18 |
Deviation of Hole Position |
±0.00394" (0.10mm) |
| 19 |
Outline Tolerance |
Routing: ±0.00394" (0.1mm) |
| Punching: ±0.00591" (0.15mm) |
| 20 |
Angle of V-cut |
30°, 45°, 60° |
| 21 |
V-cut Size |
0.1969" x 47.24" (5mm×1200mm) |
| 22 |
Thickness of V-cut Board |
0.0236" x 0.1181" (0.6-3mm) |
| 23 |
Tolerance of V-cut Angle |
±5º |
| 24 |
V-CUT Verticality |
≤0.0059" (0.15mm) |
| 25 |
Minimum Square Slots Punched |
PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm) |
| PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm) |
| 26 |
Minimum BGA PAD |
0.01378" (0.35mm) |
| 27 |
Minimum Width of Solder Mask Bridge. |
8mil (0.2032mm) |
| 28 |
Minimum Thickness of Solder Mask |
>13µm (0.013mm) |
| 29 |
Insulation Resistance |
1012ΩNormal |
| 30 |
Peel-off Strength |
2.2N/mm |
| 31 |
Solder float |
260ºC 3min |
| 32 |
E-test Voltage |
50-250V |
| 33 |
Thermal Conductivity |
0.8-8W/M.K |
| 34 |
Warp or Twist |
≤0.5% |
| 35 |
Flammability |
FV-0 |
| 36 |
Minimum Height of Component indicator |
0.0059"(0.15mm) |
| 37 |
Minimum Open Solder Mask on Pad |
0.000394" (0.01mm) |
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