RO4003c and Fr4 Mixed PCB Board for Speaker Amplifiers, Welding Machine

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: CEM-4
• Model NO.: BIC-075-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High Frequency Hybrid PCB 4 Layer Mixed PCB Board Bulit On Rogers 12mil RO4003C and FR-4
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hi Everyone,
Today, we're going to talk about 4-layer high frequency PCB made on 12mil RO4003C and FR-4 combined.

The board is designed as a 4-layer structure, because 4-layer PCB is relatively simple and inexpensive, which is helpful to open up a new market.

Let's see today's first board.


Viewing from stack up, we can see the 1st layer to the 2nd layer and 4th layer to 3rd layer are 12mil core of RO4003C, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the rest are FR-4 materials. Copper weight on inner layer and outer layer is 1 ounce.

The 2^nd board FR-4 is moved to layer 3 and layer 4. According to the actual applications, the thickness of dielectric material and FR-4 can be adjusted.

The applications of 12mil RO4003C hybrid PCB is wide, such as Modular oscilloscope, antenna combiner, balanced amplifier, 4G antenna etc.

The advantages of 12mil RO4003C hybrid PCB are reflected in following 3 points:
1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.
2) Reducing signal loss in high frequency application meets the development needs of communication technology.
3) Cost reduced over stack-ups with all low loss material;

At present, the mature mixed pressing materials are as follows:
RO4350B + FR4;
RO4003C + FR4;
F4B + FR4;
RT/duroid 5880 + RO4350B
RT/duroid 5880 + FR4

Our PCB Capability (Hybrid Design)

PCB Type:	Hybrid PCB, Mixed PCB
Hybrid type:	RO4350B + FR4;
	RO4003C + FR4;
	F4B + FR4;
	RT/duroid5880 + FR4;
	RT/duroid5880 + RO4350B
	RO3000 Series + FR4
	RT/duroid +FR4
Solder mask:	Green, Red, Blue, Black, Yellow
Layer count:	4 Layer, 6 Layer, Multilayer
Copper weight:	1oz (35µm), 2oz (70µm)
PCB thickness:	1.0-10mm
PCB size:	≤400mm X 500mm
Surface finish:	Bare copper, HASL, ENIG, Immersion tin, Immersion silver, OSP, ENEPIG, Pure gold

At the same time, we are able to supply blind via board, buried via board and HDI board. All the PCB's of our company will go through AOI test, open and short circuit test, solderability test and 288 ºC thermal stress test to ensure high quality PCB shipped to your hands.

Thank you for your reading. You're welcome to contact us for your RF PCB enquiries.

Appendix: Data Sheet of RO4003C

RO4003C Typical Value
Property	RO4003C	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.38±0.05	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.55	Z		8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0027 0.0021	Z		10 GHz/23ºC 2.5 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+40	Z	ppm/ºC	-50ºCto 150ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 x 10^10		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 x 10^9		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	Kv/mm(v/mil)	0.51mm(0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus	19,650(2,850) 19,450(2,821)	X Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	139(20.2) 100(14.5)	X Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	276 (40)		MPa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.3	X,Y	mm/m (mil/inch)	after etch+E2/150ºC	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	11 14 46	X Y Z	ppm/ºC	-55ºCto288ºC	IPC-TM-650 2.4.41
Tg	>280		ºC TMA	A	IPC-TM-650 2.4.24.3
Td	425		ºC TGA		ASTM D 3850
Thermal Conductivity	0.71		W/M/^oK	80ºC	ASTM C518
Moisture Absorption	0.06		%	48hrs immersion 0.060" sample Temperature 50ºC	ASTM D 570
Density	1.79		gm/cm^3	23ºC	ASTM D 792
Copper Peel Stength	1.05 (6.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	N/A				UL 94
Lead-free Process Compatible	Yes

Thank you for your reading and you're welcome to contact us for your PCB enquiries.