Customization: | Available |
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Type: | Rigid Circuit Board |
Dielectric: | RF-45 |
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RF-45 Typical Values | |||
Property | Test Method | Unit | Value |
Material | / | / | RF-45 |
Dielectric Constant | IPC-TM-650 2.5.5.6 | / | 4.5 |
Dissipation Factor @ 10GHz | IPC-TM-650 2.5.5.5.1 | / | 0.0037 |
Moisture Absorption | IPC-TM-650 2.6.2.1 | % | ≤0.04 |
Flexural Strength (MD) | ASTM D790 | psi | 20700 |
Flexural STRENGTH (CD) | ASTM D790 | psi | 19300 |
Peel Strength (1 oz VLP) | IPC-TM-650 2.4.8 (Thermal Stress) | lbs/linear inch | 10 |
Thermal Conductivity | ASTM F 433 | W/m/K | 0.33 |
Volume Resistivity | IPC-TM-650 2.5.17.1 | Mohm/cm | 1.4 x 108 |
Surface Resistivity | IPC-TM-650.2.5.17.1 | Mohm | 3.3 x 106 |
CTE (x) | IPC-TM-650-2.4.41 (>RT -125ºC) | ppm/ºC | 9 |
CTE (y) | IPC-TM-650-2.4.41 (>RT -125ºC) | ppm/ºC | 13 |
CTE (z) | IPC-TM-650-2.4.41 (>RT -125ºC) | ppm/ºC | 96 |
Flammability Rating | UL94 | / | V-0 |
PCB Capability (RF-45) | |
PCB Material: | Ceramic filled PTFE Resin |
Designation: | RF-45 |
Dielectric constant: | 4.5 |
Dissipation Factor | 0.0037 10GHz |
Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 20mil (0.508mm), 25mil (0.635mm), 31mil (0.787mm), 62mil (1.575mm), 125mil (3.175mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold etc.. |