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| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | Ad1000 |
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| PCB Capability (AD1000) | |
| PCB Material: | Woven Glass Reinforced PTFE/Ceramic Filled |
| Designation: | AD1000 |
| Dielectric constant: | 10.2 |
| Dissipation Factor | 0.0023 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 6mil (0.1524mm), 10.5mil (0.2667mm), 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 59mil (1.499mm ), 125mil ( 3.175mm ), 127mil (3.226mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, Pure gold, OSP etc.. |
| Property | Units | Value | Test Method |
| 1. Electrical Properties | |||
| Dielectric Constant (may vary by thickness) | |||
| @1 MHz | - | IPC TM-650 2.5.5.3 | |
| @ 10 GHz | - | 10.2 | IPC TM-650 2.5.5.5 |
| Dissipation Factor | |||
| @ 1 MHz | - | IPC TM-650 2.5.5.3 | |
| @ 10 GHz | - | 0.0023 | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric | - | ||
| TCεr @ 10 GHz (-40-150°C) | ppm/ºC | -380 | IPC TM-650 2.5.5.5 |
| Volume Resistivity | |||
| C96/35/90 | MΩ-cm | 1.40x109 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ-cm | 5.36x107 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | |||
| C96/35/90 | MΩ | 1.80x109 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ | 3.16x108 | IPC TM-650 2.5.17.1 |
| Electrical Strength | Volts/mil (kV/mm) | 622 (24.5) | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | kV | >45 | IPC TM-650 2.5.6 |
| Arc Resistance | sec | >180 | IPC TM-650 2.5.1 |
| 2. Thermal Properties | |||
| Decomposition Temperature (Td) | |||
| Initial | ºC | >500 | IPC TM-650 2.4.24.6 |
| 5% | ºC | >500 | IPC TM-650 2.4.24.6 |
| T260 | min | >60 | IPC TM-650 2.4.24.1 |
| T288 | min | >60 | IPC TM-650 2.4.24.1 |
| T300 | min | >60 | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC | ppm/ºC | 8, 10 | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC | ppm/ºC | 20 | IPC TM-650 2.4.24 |
| % z-axis Expansion (50-260ºC) | % | IPC TM-650 2.4.24 | |
| 3. Mechanical Properties | |||
| Peel Strength to Copper (1 oz/35 micron) | |||
| After Thermal Stress | lb/in (N/mm) | >12 (2.1) | IPC TM-650 2.4.8 |
| At Elevated Temperatures (150º) | lb/in (N/mm) | 13.6 (2.4) | IPC TM-650 2.4.8.2 |
| After Process Solutions | lb/in (N/mm) | IPC TM-650 2.4.8 | |
| Young's Modulus | kpsi (GPa) | 200 (1.38) | IPC TM-650 2.4.18.3 |
| Flexural Strength (Machine/Cross) | kpsi (MPa) | 9.9/7.5 (68/52) | IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) | kpsi (MPa) | 5.1/4.3 (35/30) | IPC TM-650 2.4.18.3 |
| Compressive Modulus | kpsi (GPa) | >425 (>2.93) | ASTM D-3410 |
| Poisson's Ratio | - | 0.16 | ASTM D-3039 |
| 4. Physical Properties | |||
| Water Absorption | % | 0.03 | IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC | g/cm3 | 3.20 | ASTM D792 Method A |
| Thermal Conductivity | W/mK | 0.81 | ASTM E1461 |
| Flammability | class | Meets V0 | UL-94 |
| NASA Outgassing, 125ºC, ≤10-6 torr | % | NASA SP-R-0022A | |
| Total Mass Loss | % | 0.01 | NASA SP-R-0022A |
| Collected Volatiles | % | 0.00 | NASA SP-R-0022A |
| Water Vapor Recovered | % | 0.00 | NASA SP-R-0022A |