Rogers Ad1000 Circuit Board PCB Manufacturing of Shenzhen Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Ad1000
• Model NO.: BIC-179-V2.1
• Material: Woven Glass Reinforced PTFE/Ceramic Filled
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Thickness: 30mil
• Layer Count: 2 Layers
• Application: Low Noise Amplifiers
• Surface Finish: Immersion Gold
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers AD1000 Printed Circuit Board Arlon High Frequency PCB Double Sided With Immersion Gold
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Brief Introduction
Rogers AD1000 PCB is a high - frequency material with a high dielectric constant (10.2 or higher). It is a woven glass - reinforced laminate that stands out for enabling circuit miniaturization. When compared to conventional low - loss materials, AD1000 laminate offers the advantage of reducing the size of circuits. Moreover, it provides superior dimensional stability and mechanical strength compared to other laminates with a dielectric constant of 10.

AD1000 PCBs are classified as soft materials. This characteristic allows them to withstand vibrational stress effectively. Unlike pure ceramic materials, they do not require complex or specialized processing and handling during the manufacturing process, making them more practical and cost - efficient for a wide range of applications.
 

Features:
1. Woven glass reinforced PTFE/Ceramic with high Dk of 10.2
2. Thermal conductivity of 0.81 W/mK
3. High copper peel strength allows for thinner etched line widths
4. Lowest insertion loss
5. Larger panel sizes available
6. Low moisture absorption of 0.03%
7. Highly reliability ceramic component attachment and PTH reliability resulting from excellent CTE values
 

Typical Applications:
1. Aircraft Collision Avoidance Systems (TCAS)
2. Ground Based Radar Surveillance Systems
3. Low Noise Amplifiers (LNAs)
4. Miniaturized Circuitry & Patch Antennas
5. Power Amplifiers (PAs)
6. Radar Modules and Manifolds
7. X-Band and Below

Our PCB Capability (AD1000)

PCB Capability (AD1000)
PCB Material:	Woven Glass Reinforced PTFE/Ceramic Filled
Designation:	AD1000
Dielectric constant:	10.2
Dissipation Factor	0.0023 10GHz
Layer count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
PCB thickness:	6mil (0.1524mm), 10.5mil (0.2667mm), 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 59mil (1.499mm  ), 125mil ( 3.175mm ), 127mil (3.226mm  )
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, Pure gold, OSP etc..

 

 
Why Choose Us?
1. Engineering design prevents problems from occurring in pre-production;
2. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
3. AOI inspection;
4. Delivery on time higher than 98% on-time-delivery rate;
5. 16000 workshop;
6. 30000 output capability per month;
7. 8000 types of PCB's per month;
8. Quick CADCAM checking and free PCB quotation;
9. More than 18+ years of PCB experience;
10. Customer complaint rate: <1%

Other Available High Frequency PCBs
Rogers RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3035, RO3006, RO3010, RO3210, RO3203, etc.
Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010, RT/duroid 6035HTC etc.
Rogers TMM4, TMM10, Kappa 438 etc.
PTFE F4B DK2.2, DK2.65
Taconic TLX-0, TLX-9, TLX-8, TLX-7, TLX-6, TLY-5, TLY-3, RF-35TC, RF-35, RF-35A2, RF-45, TRF-45, TLF-35, RF-60A, RF-60TC etc.
AD450, AD600, TC350 etc.

Typical Value of AD1000

Property	Units	Value	Test Method
1. Electrical Properties
Dielectric Constant (may vary by thickness)
@1 MHz	-		IPC TM-650 2.5.5.3
@ 10 GHz	-	10.2	IPC TM-650 2.5.5.5
Dissipation Factor
@ 1 MHz	-		IPC TM-650 2.5.5.3
@ 10 GHz	-	0.0023	IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric	-
TCεr @ 10 GHz (-40-150°C)	ppm/ºC	-380	IPC TM-650 2.5.5.5
Volume Resistivity
C96/35/90	MΩ-cm	1.40x109	IPC TM-650 2.5.17.1
E24/125	MΩ-cm	5.36x107	IPC TM-650 2.5.17.1
Surface Resistivity
C96/35/90	MΩ	1.80x109	IPC TM-650 2.5.17.1
E24/125	MΩ	3.16x108	IPC TM-650 2.5.17.1
Electrical Strength	Volts/mil (kV/mm)	622 (24.5)	IPC TM-650 2.5.6.2
Dielectric Breakdown	kV	>45	IPC TM-650 2.5.6
Arc Resistance	sec	>180	IPC TM-650 2.5.1
2. Thermal Properties
Decomposition Temperature (Td)
Initial	ºC	>500	IPC TM-650 2.4.24.6
5%	ºC	>500	IPC TM-650 2.4.24.6
T260	min	>60	IPC TM-650 2.4.24.1
T288	min	>60	IPC TM-650 2.4.24.1
T300	min	>60	IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC	ppm/ºC	8, 10	IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC	ppm/ºC	20	IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC)	%		IPC TM-650 2.4.24
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress	lb/in (N/mm)	>12 (2.1)	IPC TM-650 2.4.8
At Elevated Temperatures (150º)	lb/in (N/mm)	13.6 (2.4)	IPC TM-650 2.4.8.2
After Process Solutions	lb/in (N/mm)		IPC TM-650 2.4.8
Young's Modulus	kpsi (GPa)	200 (1.38)	IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross)	kpsi (MPa)	9.9/7.5 (68/52)	IPC TM-650 2.4.4
Tensile Strength (Machine/Cross)	kpsi (MPa)	5.1/4.3 (35/30)	IPC TM-650 2.4.18.3
Compressive Modulus	kpsi (GPa)	>425 (>2.93)	ASTM D-3410
Poisson's Ratio	-	0.16	ASTM D-3039
4. Physical Properties
Water Absorption	%	0.03	IPC TM-650 2.6.2.1
Density, ambient 23ºC	g/cm3	3.20	ASTM D792 Method A
Thermal Conductivity	W/mK	0.81	ASTM E1461
Flammability	class	Meets V0	UL-94
NASA Outgassing, 125ºC, ≤10-6 torr	%		NASA SP-R-0022A
Total Mass Loss	%	0.01	NASA SP-R-0022A
Collected Volatiles	%	0.00	NASA SP-R-0022A
Water Vapor Recovered	%	0.00	NASA SP-R-0022A