Manufacturing Hybrid RF PCB for Audio/Video Systems, LED Boards, Metal Detectors & Phone Motherboards

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: CEM-4
• Model NO.: BIC-073-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello everyone,
Warm greetings!

The hybrid PCB can be a mixture of FR-4 and high frequency material, and a mixture of high frequency material with different dielectric constant (DK), for example RT/duroid 5880 and RO4350B etc.

Today we'll talk about a type of mixed high frequency PCB made on 13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/duroid 5880. It's for the application of multi-coupler antenna.

This is a 3-layer board that one layer is etched off.

The basic specifications are as follows:
Base material: RO4350B 13.3mil (0.338mm) + RT/duroid 5880 31 mil (0.787mm)
Dielectric constant: 3.48+/-0.05
Layer count: 3 layers
Via type: Through holes, blind vias
Format: 160mm x 90mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35μm | Inner layer 35μm
Solder mask / Legend: Green / White
Final PCB height: 1.3 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 20 working days
Shelf life: 6 months

Features and benefits
1) Lowest electrical loss for reinforeced PTFE material
2) Enhanced electrical performance;
3) 16000 square meter workshop;
4) 30000 square meter month capability;
5) 8000 types of PCB's per month;
6) More than 17 years of PCB experience;

Applications
Point to Point Digital Radio Antennas, WiFi Amplifier, Tower-mounted Booster, Power Amplifier, RF Module

Properties of RT/duroid 5880

RT/duroid 5880 Typical Value
Property	RT/duroid 5880		Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	2.20 2.20±0.02 spec.		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign	2.2		Z	N/A	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0004 0.0009		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε	-125		Z	ppm/ºC	-50ºCto 150ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	2 x 10^7		Z	Mohm cm	C/96/35/90	ASTM D 257
Surface Resistivity	3 x 10^7		Z	Mohm	C/96/35/90	ASTM D 257
Specific Heat	0.96(0.23)		N/A	j/g/k (cal/g/c)	N/A	Calculated
Tensile Modulus	Test at 23ºC	Test at 100ºC	N/A	MPa(kpsi)	A	ASTM D 638
	1070(156)	450(65)	X
	860(125)	380(55)	Y
Ultimate Stress	29(4.2)	20(2.9)	X
	27(3.9)	18(2.6)	Y
Ultimate Strain	6	7.2	X	%
	4.9	5.8	Y
Compressive Modulus	710(103)	500(73)	X	MPa(kpsi)	A	ASTM D 695
	710(103)	500(73)	Y
	940(136)	670(97)	Z
Ultimate Stress	27(3.9)	22(3.2)	X
	29(5.3)	21(3.1)	Y
	52(7.5)	43(6.3)	Z
Ultimate Strain	8.5	8.4	X	%
	7.7	7.8	Y
	12.5	17.6	Z
Moisture Absorption	0.02		N/A	%	0.62"(1.6mm) D48/50	ASTM D 570
Thermal Conductivity	0.2		Z	W/m/k	80ºC	ASTM C 518
Coefficient of Thermal Expansion	31 48 237		X Y Z	ppm/ºC	0-100ºC	IPC-TM-650 2.4.41
Td	500		N/A	ºC TGA	N/A	ASTM D 3850
Density	2.2		N/A	gm/cm^3	N/A	ASTM D 792
Copper Peel	31.2(5.5)		N/A	Pli(N/mm)	1oz(35mm)EDC foil after solder float	IPC-TM-650 2.4.8
Flammability	V-0		N/A	N/A	N/A	UL 94
Lead-free Process Compatible	Yes		N/A	N/A	N/A	N/A

Thank you for your reading and you're welcome to contact us for your PCB enquiries.