| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | 370hr |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction to ISOLA 370HR:
370HR laminates and prepregs, designed by Polyclad, utilize a patented high-performance FR-4 multifunctional epoxy resin system with a glass transition temperature (Tg) of 180°C, making it suitable for multilayer PCB applications where maximum thermal performance and reliability are essential. Manufactured with high-quality E-glass fabric, 370HR offers superior conductive anodic filament (CAF) resistance, low coefficient of thermal expansion (CTE), and excellent mechanical, chemical, and moisture resistance properties.
370HR is widely adopted in PCB designs and is recognized for its thermal reliability, ease of processing, and proven performance in sequential lamination.
Properties:
Glass Transition Temperature (Tg): 180°C
Decomposition Temperature (Td): 340°C (5% weight loss)
Time to Delaminate: T260 of 60 minutes, T288 of 30 minutes
Coefficient of Thermal Expansion (CTE):
Pre-Tg: Z-Axis: 45 ppm/°C, X/Y-Axis: 13/14 ppm/°C
Thermal Conductivity: 0.4 W/MK
Dielectric Constant (DK):3.92 at 5 GHz, 4.24 at 100 MHz, 4.17 at 1 GHz, 4.04 at 2 GHz
Loss Tangent (Df):0.025 at 5 GHz and 10 GHz, 0.015 at 100 MHz, 0.0161 at 1 GHz, 0.021 at 2 GHz
Dielectric Breakdown: > 50 kV
Comparative Tracking Index (CTI): 175V-249V
Moisture Absorption: 0.15%
Flammability Rating: UL94-V0
PCB Construction Details:
| Specification | Details | |
|---|---|---|
| Base Material | 370HR | |
| Layer Count | 6 layers | |
| Board Dimensions | 40mm x 55mm (± 0.15mm) | |
| Minimum Trace/Space | 4/4 mils | |
| Minimum Hole Size | 0.2mm | |
| Blind Vias & Buried Vias | GTL to INN 1, INN2-INN3 | |
| Finished Board Thickness | 1.6mm | |
| Finished Copper Weight | 1 oz (1.4 mils) for inner and outer layers | |
| Via Plating Thickness | 20 µm | |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) | |
| Top Silkscreen | White | |
| Bottom Silkscreen | White | |
| Top Solder Mask | Green | |
| Bottom Solder Mask | Green | |
| Top Layer Traces | 10 mils with 50-ohm impedance control | |
| Electrical Testing | 100% Electrical Testing conducted prior to shipment |
6-Layer PCB Stackup (370HR):
| Layer | Filename | Thickness (mil) |
|---|---|---|
| Signal | Top | 1.4 |
| Plane | GND | 1.4 |
| Signal | SIG1 | 1.4 |
| Signal | SIG2 | 1.4 |
| Plane | PWR | 1.4 |
| Signal | Bottom | 1.4 |
| Total | 62.0 mil |
PCB Statistics:
Components: 31
Total Pads: 46
Through Hole Pads: 29
Top SMT Pads: 17
Bottom SMT Pads: 0
Vias: 24
Nets: 5
Artwork and Standards Information
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
Attributes:
Typical Applications:
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