Rogers Diclad 880 Circuit Board PCB of Shenzhen Designer

• Customization: Available
• Structure: Multilayer Rigid PCB
• Dielectric: Diclad 880
• Model NO.: BIC-201-V2.1
• Material: Woven Fiberglass Reinforced, PTFE-Based Composites
• Application: Antennas Radar
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.
• Laminate Thickness: 20mil 30mil 60mil
• Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB
• Solder Mask: Green, Black, Blue, Yellow, Red etc.
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers DiClad 880 High Frequency PCB 20mil 30mil 60mil with Gold, Tin and Silver
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Brief Introduction
Rogers DiClad 880 printed circuit boards are constructed from woven fiberglass-reinforced PTFE-based composites that exclude ceramic fillers. By reducing the number of woven fiberglass plies and increasing the proportion of PTFE,  DiClad 880 PCBs achieve lower dielectric constant and dissipation factor values. In fact, their DK (dielectric constant) and DF (dissipation factor) metrics are comparable to those of RT/duroid 5880.

The dielectric constant of Rogers DiClad 880 circuit boards can be finely tuned through meticulous control of the mixing ratio between woven fiberglass and PTFE. An increased amount of fiberglass leads to a higher dielectric constant, while simultaneously enhancing dimensional stability. To ensure uniform performance in the XY plane, the woven fiberglass layers within the boards are aligned in the same direction. Thanks to the reinforcement provided by woven fiberglass, Rogers DiClad 880 laminate demonstrates superior dimensional stability in the XY direction compared to RT/duroid 5880 and RT/duroid 5870. However, this comes at the cost of a higher coefficient of thermal expansion in the Z-axis direction.
 

 
 

Features:

1. Extremely Low Loss Tangent at 0.0009
2. Excellent Dimensional Stability
3. Product Performance Uniformity

Benefits:

1. Electrical Properties are Highly Uniform Across Frequency
2. Consistent Mechanical Performance
3. Excellent Chemical Resistance

Typical Applications:

1. Commercial Phased Array Networks
2. Digital Radio Antennas
3. Filters, Couplers, LNAs
4. Low Loss Base Station Antennas
5. Radar Feed Networks
6. Missile Guidance Systems

PCB Capability (DiClad 880)

PCB Capability (DiClad 880)
PCB Material:	Woven Fiberglass Reinforced, PTFE-based Composites
Designation:	DiClad 880
Dielectric constant:	2.20  (10 GHz)
Dissipation factor	0.0009 (10 GHz)
Layer count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness	20mil (0.508mm), 30mil (0.762mm),  60mil (1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Immersion gold (ENIG), HASL,  Immersion silver, Immersion tin, OSP, ENEPIG, Bare Copper, Pure gold plated etc..

Our Advantages

1. Engineering design prevents problems from occurring in pre-production;
2. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
3. AOI inspection;
4. Powerful PCB capabilities support your research and development, sales and marketing;
5. Delivery on time higher than 98% on-time-delivery rate;
6. Any Layer HDI PCBs;
7. 16000 workshop; 30000 output capability per month; 8000 types of PCB's per month;
8. Quick CADCAM checking and free PCB quotation;
9. Diversified shipping method: FedEx, DHL, TNT, EMS;
10. No MOQ, low cost for prototypes and small runs quantity;

Appendix: Typical Properties of DiClad 880

Property	Test Method	Condition	DiClad 880
Dielectric Constant  @ 10 GHz	IPC TM-650 2.5.5.5	C23/50	2.17, 2.20
Dielectric Constant  @ 1 MHz	IPC TM-650 2.5.5.3	C23/50	2.17, 2.20
Dissipation Factor @ 10 GHz	IPC TM-650 2.5.5.5	C23/50	0.0009
Dissipation Factor @ 1 MHz	IPC TM-650 2.5.5.3	C23/50	0.0008
Thermal Coefficient of Er (ppm/°C)	IPC TM-650 2.5.5.5 Adapted	-10°C to +140°C	-160
Peel Strength  (lbs.per inch)	IPC TM-650 2.4.8	After Thermal Stress	14
Volume Resistivity (M-cm)	IPC TM-650 2.5.17.1	C96/35/90	1.4 x 10 9
Surface Resistivity (M)	IPC TM-650 2.5.17.1	C96/35/90	2.9 x 10 6
Arc Resistance	ASTM D-495	D48/50	>180
Tensile Modulus (kpsi)	ASTM D-638	A, 23°C	267, 202
Tensile Strength (kpsi)	ASTM D-882	A, 23°C	8.1, 7.5
Compressive Modulus (kpsi)	ASTM D-695	A, 23°C	237
Flexural Modulus (kpsi)	ASTM D-790	A, 23°C	357
Dielectric Breakdown (kV)	ASTM D-149	D48/50	>45
Density (g/cm3)	ASTM D-792 Method A	A, 23°C	2.23
Water Absorption (%)	MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2	E1/105 + D24/23	0.02
Coefficient of Thermal	IPC TM-650 2.4.24	0°C to 100°C
Expansion (ppm/°C)	Mettler 3000
X  Axis	Thermomechanical		25
Y Axis	Analyzer		34
Z Axis			252
Thermal Conductivity (W/mK)	ASTM E-1225	100°C	0.261
Outgassing	NASA SP-R-0022A	125°C, ≤ 10-6 torr
Total Mass Loss (%)	Maximum 1.00%		0.01
Collected Volatile	Maximum 0.10%		0.01
Condensable Material (%)
Water Vapor Regain (%)			0.01
Visible Condensate (±)			NO
Flammability UL File E 80166	UL 94 Vertical Burn IPC TM-650 2.3.10	C48/23/50, E24/125	Meets requirements of UL94-V0