Brief Introduction
With the development of electronic communication technology, the communication frequency
is becoming higher and higher, and the high frequency signal transmission, need to use low
dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. These materials
have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive.
Reducing the cost is an important means for customers to improve the competitiveness of
products. Therefore, the customers adopt the laminated structure of mixed materials in the
design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
meet the needs of signal transmission. Other line layers are made of conventional fiberglass
epoxy FR-4, which we call a hybrid board.
Available high frequency material (Core)
RO4350B RO4003C
4mil (0.1mm) 8mil (0.203mm)
6.6mil (0.168mm) 12mil (0.3mm)
10mil (0.254mm) 20mil (0.508mm)
13.3mil (0.338mm) 32mil (0.813mm)
20mil (0.508mm) 60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)
PCB Case: 4 Layer PCB On 0.254mm RO4350B 18/18um +
FR4 0.36mm 35/35um With Immersion Gold
(Printed circuit boards are custom-made products, the picture and parameters shown are just
for reference)
General description
This is a type of 4 Layer PCB mixing 0.254mm (10 mil) RO4350B and 0.36mm FR-4 for the
application of Variable Frequency Drive.
The multilayer mixed-press printed circuit board comprises an insulating dielectric layer and
a signal layer. And the dielectric layer and the signal layer are alternately stacked. The signal
layer comprises a signal layer for transmitting a high speed signal and a signal layer for
transmitting a low speed signal. The high frequency characteristic of the RO4350B substrate
is better than that of FR-4 substrate, and the dielectric loss caused by the transmission signal
is smaller than that of FR-4 substrate. The invention of multilayer mixed-press can not only
ensure the high frequency performance of the printed circuit board, but also reduce the
manufacturing cost of the multilayer PCB made of full high frequency material.
Basic specifications
Base material: RO4350B 0.254 mm + FR4 0.36 mm + PP 0.36 mm
Layer count: 4 layers
Type: Single PCB
Format: 205.15 X 45.68mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 35 μm
Solder mask / Legend: green / white
Final PCB height: 1.3 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
The characteristic of low dielectric loss makes the signal loss at a lower level, which makes
the signal transmission of the whole equipment excellent;
Good oxidation resistance and good heat dissipation;
Improved the speed of signal transmission;
Powerful PCB capabilities support your research and development, sales and marketing;
Impedance control test and solder-ability test;
Professional and experienced engineers;
More than 15 years of PCB experience;
UL, ISO14001, TS16949 certified;
Application
RF transmitter, WiFi amplifier, RFID, Attenuator
Parameter and data sheet
PCB SIZE |
205.15 X 45.68mm = 1piece |
BOARD TYPE |
Multlayer PCB |
Number of Layers |
4 Layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
Copper -----Signal 18um(0.5 oz)+plate TOP layer |
RO4350B 0.254 mm |
Copper -----Signal 0.018 mm |
Prepreg 2116 X 3, 0.36mm |
Copper ----- Plain 0.035 mm |
FR-4 0.36mm |
Copper ------- 18um(0.5oz) + plate BOT Layer |
TECHNOLOGY |
|
Minimum Trace and Space: |
5.5 mil / 7.5 mil |
Minimum / Maximum Holes: |
0.4 mm / 5.7 mm |
Number of Different Holes: |
12 |
Number of Drill Holes: |
135 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
NA |
Impedance Control: |
N/A |
Number of Gold finger: |
N/A |
BOARD MATERIAL |
|
Glass Epoxy: |
RO4350B Tg280ºC, er<3.48, Rogers Corp.; FR-4 IT158, ITEQ |
Final foil external: |
1.0 oz |
Final foil internal: |
1.0 oz |
Final height of PCB: |
1.3 mm ±10% |
PLATING AND COATING |
|
Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Both Sides |
Solder Mask Color: |
Green, Taiyo PSR-2000 GT800D |
Solder Mask Type: |
LPI |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
TOP |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged
FREE AREA |
VIA |
Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Quality Policy
Bicheng has developed series of management procedures and approaches to assure that PCBs
are in compliance with the customers' requirements, inclusive of selection of the vendors, work in
progress (WIP) inspection, outgoing delivery inspection and customer service etc.
Evaluation and Audit of Suppliers
Suppliers have to be evaluated by Bicheng. In addition, Bicheng will appraise and rank suppliers
every year to guarantee the materials supplied are meeting Bicheng's requirements. Furthermore,
Bicheng continuously develop suppliers and supervise them to improve their quality and
environment management basing on the systems of ISO9001 & ISO14001.
Contract Evaluation
Bicheng shall review and verify customer's requirements to make sure that we have the capability
to satisfy customers' requirements including specifications, delivery and other demands prior to
accepting an order.
Making, audit and control of manufacturing data.
When customers' design data and specifications are provided to our market department, Bicheng
has to verify all the requirements. Then, convert the design data into manufacturing data by CAM.
Finally, a manufacturing instruction (MI) is generated according to the real manufacturing process
and technologies for manufacturing department as the basis for actual fabrication. MI must be
reviewed by independent engineers and QA engineers before issue.
Incoming Material Quality Control
All materials have to be inspected before warehousing. We established a series of strict inspection
procedure and instruction to control the incoming materials. Furthermore, various precise
inspecting instruments and apparatus guarantee the capability to judge the material good or not.
We issue material with first in first out principle, and give out "alarm" for the material that will reach
the shelf life to ensure the materials are used up before expiry.
Control of Production Process
Right manufacturing instruction (MI), comprehensive equipment management and maintenance
and process control, strict WIP inspection and monitoring as well as working instruction, all those
make the whole fabrication process totally controlled.
Final Control and Inspection
All PCBs have to be gone through the open and short test as well as visual inspection after passed
the specified physical tests. We own various advanced test equipment including customized, probe
flying test machines to guarantee that each PCB is 100% tested.
Product Delivery Audit
We set up a dedicated FQA department to inspect the PCB products according to the customer's
specifications and requirements by sampling. Qualified PCBs are going to be packed.
FQA also has to carry out a 100% audit of the warehouse packing and shipping products, including
product number, customer number, product quantity, shipping address and so on prior to shipment.
Customer Service
We sets up a professional customer service team to proactively communicate with customers and
timely deal with the customers' feedbacks. We highly focus on customers' needs and to understand
customers' demands, timely to adjust the policy of customer service and PCB product
requirements.
Variety of PCBs