Ultra-Thin Double-Sided RO4350B PCB - 0.8mm Thickness with ENEPIG Finish for RF Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. Advanced PCB Overview
This precision-engineered double-sided PCB utilizes Rogers RO4350B high-frequency laminate to deliver exceptional performance in compact RF applications. Designed for cellular infrastructure, automotive radar systems, and satellite communications, this ultra-thin 0.8mm board combines superior electrical characteristics with robust mechanical properties. Certified to IPC-Class-2 standards, it features ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface finish for enhanced reliability in harsh environments.
Key Performance Advantages:
Ultra-Compact Design: 52.00mm x 38.00mm dimensions ideal for space-constrained applications
Enhanced Signal Integrity: Dielectric constant of 3.48±0.05 @ 10GHz with low loss tangent (0.0037)
Premium Surface Treatment: ENEPIG finish offers superior corrosion resistance and wire-bonding capability
Thermal Stability: Operating range of -40°C to +85°C with Tg >280°C
Advanced Construction: Features countersunk holes and edge plating for mechanical durability
2. Technical Specifications Summary
| Parameter |
Specification |
| Core Material |
Rogers RO4350B |
| Layer Configuration |
Double-Sided |
| Board Dimensions |
52.00mm x 38.00mm (±0.15mm) |
| Minimum Trace/Space |
8/6 mils |
| Minimum Drilled Hole |
0.5mm |
| Special Features |
Countersunk holes, edge plating |
| Finished Thickness |
0.8mm |
| Copper Weight |
1 oz (35µm) all layers |
| Via Treatment |
0.5mm copper paste filled & capped |
| Surface Finish |
ENEPIG |
| Solder Mask |
Matte Black (Both Sides) |
| Quality Assurance |
100% Electrical Tested |
3. Enhanced Design Features
Innovative Stackup Configuration
Conductive Layers: 17µm base copper (1 oz) on both sides
Dielectric Core: 30mil RO4350B substrate for optimal signal transmission
Thermal Management: 0.69 W/m/K conductivity for effective heat dissipation
Manufacturing Excellence
Component Density: Supports 15 components with 53 total pads (17 thru-hole, 35 SMT)
Interconnect Solution: 45 precision vias with copper paste filling
File Compatibility: Gerber RS-274-X format for seamless fabrication
Rigorous Testing: Full electrical validation to IPC-Class-2 standards
Material Superiority
Dimensional Stability: CTE of 10/12/32 ppm/°C (X/Y/Z) matches copper expansion
Flame Resistance: UL 94 V-0 rated for high-reliability applications
Moisture Protection: Matte black solder mask enhances environmental protection
Target Applications
5G Network Components: Base station antennas and RF power amplifiers
Automotive Electronics: Radar sensors and collision avoidance systems
Satellite Technology: Low-noise block converters (LNBs) for broadcast
IoT Devices: High-frequency identification tags and sensors
Competitive Advantages
1. Space-Saving Profile: Ultra-thin 0.8mm construction with compact footprint
2. High-Frequency Optimization: 8/6 mil trace/space for precision RF layouts
3. Enhanced Durability: Countersunk holes and edge plating for mechanical robustness
4. Premium Finish: ENEPIG surface for superior solderability and wire bonding
Request Your Custom RF Solution Today
Contact our engineering team for specialized configurations or volume production quotes. Perfect for applications demanding high-frequency performance in minimal space.
Thank you for your reading and you're welcome to contact us for your PCB enquiries.
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