4 Layer Printed Circuit Board Built on 0.01" (0.254mm) RO4350b + Fr4

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO4350b and Fr-4
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Basic Info.

Model NO.
BIC-104-V104
Material
Hydrocarbon/Woven Glass +Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Glass Reinforced Hydrocarbon+Epoxy Resin
Final Foil External
1.0 Oz
Final Foil Internal
1.0 Oz
Board Thickness
1.3 mm ±10%
Surface Finish
Immersion Gold
Solder Mask Color
Green
Colour of Component Legend
White
Minimum Trace and Spac
9.8 Mil / 5.8 Mil
Minimum / Maximum Holes
0.3 mm / 2.6 mm
Via
Minimum Size 0.3mm
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
108 x 36mm=1PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
5834009000
Production Capacity
50000PCS/Month

Product Description

Brief Introduction
With the development of electronic communication technology, the communication frequency
is becoming higher and higher, and the high frequency signal transmission, need to use low
dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. These materials
have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based materials
(PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic). Usually these
materials are expensive. 
Reducing the cost is an important means for customers to improve the competitiveness of products.
Therefore, the customers adopt the laminated structure of mixed materials in the design of PCB
structure, that is, the necessary signal layer uses high-frequency materials to meet the needs of signal
transmission. Other line layers are made of conventional fiberglass epoxy FR-4, which we call a hybrid
board.

Available high frequency material (Core)
RO4350B            RO4003C
4mil (0.1mm)        8mil (0.203mm)
6.6mil (0.168mm)    12mil (0.3mm)
10mil (0.254mm)        20mil (0.508mm)
13.3mil (0.338mm)    32mil (0.813mm)
20mil (0.508mm)        60mil (1.524mm)
30mil (0.762mm)    
60mil (1.524mm)    



PCB Case: 4 Layer Printed Circuit Board Built On 0.01"
(0.254mm) RO4350B + FR4
(PCB's are custom-made products, the picture and parameters shown are just for reference)

General description
This is a type of 4 Layer hybrid PCB mixed 0.254mm (10 mil) RO4350B and 0.36mm FR-4 for
the application of High Speed Servers. 

Basic specifications
Base material: RO4350B 0.254 mm + FR4 0.36 mm + PP 0.36 mm
Layer count: 4 layers
Type: Single individual board
Format: 108mm x 36mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 35 μm
Solder mask / Legend: Green / white
Final PCB height: 1.3 mm
Standard: IPC 6012 Class 2
Packing: 25 pieces are packed for shipment. 
Lead time: 10 working days
Shelf life: 6 months

Features and benefits    
RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes
it an ideal substrate for broadband applications;
SI performance improvement over the stack-ups with all FR4 board;
Cost reduction over stack-ups with all low loss material;
Reliability test, insulation resistance test and ionic contamination test;
Meeting your PCB needs from prototype to mass production;
UL, ISO14001, TS16949 certified;
Delivery on time: >98%  
Customer complaint rate: <1% 

Application
UHF radio, Interference filter,    Indoor wall hanging antenna,    Combiner

Parameter and data sheet
PCB SIZE 108 x 36mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18µm(0.5 oz)+plate TOP layer
RO4350B 0.254mm
copper ------- 18µm
Prepreg 0.36mm
copper ------- 35µm
FR-4 Core 0.36mm
copper ------- 18µm(0.5oz) + plate  BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 9.8 mil / 5.8 mil
Minimum / Maximum Holes: 0.3 mm / 2.6 mm
Number of Different Holes: 5
Number of Drill Holes: 112
Number of Milled Slots: 0
Number of Internal Cutouts: NO
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  RO4350B Tg280ºC, er<3.48, Rogers Corp; FR-4 IT158
Final foil external:  1.0 oz
Final foil internal:  1 oz
Final height of PCB:  1.3 mm ±10%
PLATING AND COATING  
Surface Finish Immersion gold
Solder Mask Apply To:  TOP and Bottom, 15 micron Minimum
Solder Mask Color:  Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend Both top and bottom sides
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Quality Policy
Bicheng has developed series of management procedures and approaches to assure that PCBs
are in compliance with the customers' requirements, inclusive of selection of the vendors, work in
progress (WIP) inspection, outgoing delivery inspection and customer service etc.
  
Evaluation and Audit of Suppliers 
Suppliers have to be evaluated by Bicheng. In addition, Bicheng will appraise and rank suppliers
every year to guarantee the materials supplied are meeting Bicheng's requirements. Furthermore,
Bicheng continuously develop suppliers and supervise them to improve their quality and environment
management basing on the systems of ISO9001 & ISO14001. 

Contract Evaluation 
Bicheng shall review and verify customer's requirements to make sure that we have the capability
to satisfy customers' requirements including specifications, delivery and other demands prior to
accepting an order.

Making, audit and control of manufacturing data
When customers' design data and specifications are provided to our market department, Bicheng
has to verify all the requirements. Then, convert the design data into manufacturing data by CAM.
Finally, a manufacturing instruction (MI) is generated according to the real manufacturing process
and technologies for manufacturing department as the basis for actual fabrication. MI must be
reviewed by independent engineers and QA engineers before issue.

Incoming Material Quality Control
All materials have to be inspected before warehousing. We established a series of strict inspection
procedure and instruction to control the incoming materials. Furthermore, various precise inspecting
instruments and apparatus guarantee the capability to judge the material good or not. We issue
material with first in first out principle, and give out "alarm" for the material that will reach the shelf life
to ensure the materials are used up before expiry.

Control of Production Process
Right manufacturing instruction (MI), comprehensive equipment management and maintenance and
process control, strict WIP inspection and monitoring as well as working instruction, all those make
the whole fabrication process totally controlled. 

Final Control and Inspection 
All PCBs have to be gone through the open and short test as well as visual inspection after passe
the specified physical tests. We own various advanced test equipment including customized, probe
flying test machines to guarantee that each PCB is 100% tested.

Product Delivery Audit
We set up a dedicated FQA department to inspect the PCB products according to the customer's
specifications and requirements by sampling. Qualified PCBs are going to be packed. 

FQA also has to carry out a 100% audit of the warehouse packing and shipping products, including
product number, customer number, product quantity, shipping address and so on prior to shipment.

Customer Service
We sets up a professional customer service team to proactively communicate with customers and
timely deal with the customers' feedbacks. We highly focus on customers' needs and to understand
customers' demands, timely to adjust the policy of customer service and PCB product requirements.


Variety of PCBs


Workshop environment

 

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