General profile
Just as its name implies, high frequency is that the frequency is relatively high, generally refers to the frequency of >=300 MHz (i.e. wave length <=1m), that is, the usual radio frequency band. The electromagnetic wave of frequency >=1GHz is called microwave.
Typical frequencies for wireless applications:
* Current mobile: 0.9GHz - 2GHz
* 3G systems: 2.5GHz
* Bluetooth: 2.5GHz
* GPS: 12.6GHz
* LMDS: 24GHz and 40GHz
* Automotive: 77GHz
Market: RFID, Wireless communications, base station and antenna, amplifier, military products, consumer electronics.
High frequency printed circuit board or microwave PCB refers to the printed circuit board made on the high frequency (microwave) substrate copper clad plate. The common types are: Double-sided board, multilayer board and mixed structure.
Mixed structure includes high performance special substrate, PP sheet + ordinary performance board and PP sheet mixed pressing board; high frequency substrate + ordinary FR4 substrate; high frequency substrate + metal base etc.
Advantages
1) The dielectric constant (DK) is low and stable, so the signal transmission is good without delay;
2) The characteristic of low dielectric loss makes the signal loss at a lower level, which makes the signal transmission of the whole equipment excellent;
3) Delamination of copper foil will not be caused by the change of cold and heat due to the consistency with the thermal expansion coefficient of copper foil;
4) Low water absorbability influences dielectric constant and dielectric loss less at damp;
5) Heat resistance, chemical resistance, impact strength and peeling strength are good;
6) The temperature coefficient of dielectric constant is among the lowest of any circuit board material, making it ideal for temperature sensitive applications;
Applications
amplifier, antenna, low noise amplifier, preamplifier, splitter, transmitter, uhf radio, rf module, rf transceiver, rf transmitter
Design For Manufacture
This manufacturability guide provides an overview of various areas that printed circuit board designer may take into consideration on the fabrication possibility, manufacturing cost and reliability of their products. This DFM is divided into 6 parts for our readers. This is the section III.
| Serial NO. |
Procedure |
Item |
Manufacturing capability |
| Large volume (S<100 m²) |
Middle volume (S<10 m²) |
Prototype(S<1m²) |
|
| 31 |
Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) |
Maximum via-plug diameter |
0.5mm |
0.5mm |
0.5mm |
| 32 |
Min.width of solder mask bridge |
Green:5mil(35um) |
Green:4mil(35um) |
Green:4mil(35um) |
| 33 |
Yellow:5mil(35um) |
Yellow:4mil(35um) |
Yellow:4mil(35um) |
| 34 |
Blue:5mil(35um) |
Blue:4mil(35um) |
Blue:4mil(35um) |
| 35 |
Black:6mil(35um) |
Black:6mil(35um) |
Black:6mil(35um) |
| 36 |
White:6mil(35um) |
White:6mil(35um) |
White:6mil(35um) |
| 37 |
All of Matt:6mil |
All of Matt:6mil |
All of Matt:6mil |
| 38 |
Green:5mil(70um) |
Green:4mil(70um) |
Green:4mil(70um) |
| 39 |
Yellow:5mil(70um) |
Yellow:4mil(70um) |
Yellow:4mil(70um) |
| 40 |
Blue:5mil(70um) |
Blue:4mil(70um) |
Blue:4mil(70um) |
| 41 |
Black:6mil(70um) |
Black:6mil(70um) |
Black:6mil(70um) |
| 42 |
White:6mil(70um) |
White:6mil(70um) |
White:6mil(70um) |
| 43 |
Open solder mask |
4mil(35um) |
4mil(35um) |
3mil(35um) |
| 44 |
Solder mask coverage |
4mil(35um) |
4mil(35um) |
3mil(35um) |
| 45 |
Min.width of solder mask text |
9mil(35um) |
9mil(35um) |
8mil(35um) |
| 46 |
Min.thickness of Solder mask |
9um(35um) |
9um(35um) |
9um(35um) |
| 47 |
Max.thickness of solder mask |
30um(35um) |
30um(35um) |
30um(35um) |
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Audited Supplier 
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