PCB Spacer Blank Board Built on 1.5mm Fr-4

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-886-V8.86
• Material: Fiberglass Epoxy
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Board Thick: 1.65mm
• Surface Finish: No Required
• out Layer Copper: No Required
• Soldermask Color: No Required
• Silkscreen Color: No Required
• Mininum Trace (Mil): No Required
• Minimum Gap(Mil): No Required
• RoHS Required: Yes
• Warpage: 0.15%
• Test: 100% Electronic Test
• Transport Package: Vacuum
• Specification: 126mm x 50mm =1up
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000 PCS/ Month

Product Description

1.1 General description

This is a type of blank PCB built on FR-4 substrate with Tg 150°C for the application of spacer.
It's 1.6 mm thick without silkscreen, without solder mask, without copper pattern and surface finish.
The base material is from ITEQ supplying single PCBup. They're fabricated per IPC 6012 Class 2
using supplied Gerber data. Each 40 panels are packed for shipment. 

1.2 Features and benifits    

a. Very Low Moisure Absorption and better CAF resistance;
b. Excellent dimensionaly stability;
c. Strict WIP inspection and monitoring as well as working instruction;
d. Great customer service;
e.  Diversified shipping method;
f.   Delivery on time: >98%  
g.  Customer complaint rate: <1% 

1.3 Application

Satellite Radio, Microcontroller, Vehicle Tracking, WiFi Antena, 3G USB Modem, Embedded
Systems Pdf, Satellite Systems, Embedded Computing, Splitter Module, Weather analysis

1.4 Parameter and data sheet

Number of Layers	N/A
Board Type	Blank Spacer
Board Size	126 x 50 mm =1UP
Board Thickness	1.5mm +/-0.15
Board Material	FR-4
Board Material Supplier	ILM
Tg Value of Board Material	TG135ºC
PTH Cu thickness	N/A
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	N/A
Solder Mask Type and Model No.	N/A
Solder Mask Supplier	N/A
Solder Mask Colour	N/A
Number of Solder Masks	N/A
Thickness of Solder Mask	N/A
Type of Silkscreen Ink	N/A
Supplier of Silkscreen	N/A
Color of Silkscreen	N/A
Number of Silkscreen	N/A
Mininum Trace (mil)	N/A
Minimum Gap(mil)	N/A
Surface Finish	N/A
RoHS Required	Yes
Warpage	0.15%
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	N/A
Function	visual inspection
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2