3 Layer High Frequency PCB Built on 60mil RO4350b and 6.6mil RO4350b with Enig for Wireless Booster

• Customization: Available
• Type: Rigid Circuit Board
• Material: Fiberglass Epoxy
• Model NO.: BIC-147-V1.47
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Final Foil External: 1 Oz
• Final Foil Internal: 1 Oz
• Final Height of PCB: 1.88 mm ±10%
• Surface Finish: Immersion Gold
• Via: Plated Through Hole(Pth), Minimum Size 0.4mm
• Minimum Trace and Space: 4 Mil / 4 Mil
• Minimum / Maximum Holes: 0.4 mm / 3.5 mm
• Test: 100% Electrical Test Prior Shipment
• Flamibility Rating: UL 94-V0 Approval Min
• Contour/Cutting: Routing
• Transport Package: Vacuum
• Specification: 110 x 110mm=1PCS
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534001000
• Production Capacity: 50000PCS/Month

Product Description

3 Layer High Frequency PCB Built On 60mil RO4350B and 6.6mil RO4350B with ENIG for Wireless Booster
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hi Everyone,
Multilayer high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive. For example, a 4-layer RO4350B PCB is a compound of 2 cores of RO4350B substrates. As is known to all, there're 8 cores in RO4350B family, i.e. 4mil (0.101mm) to 60mil (1.524mm).

RO4350B:
4mil	0.101mm
6.6mil	0.168mm
10mil	0.254mm
13.3mil	0.338mm
16.6mil	0.422mm
20mil	0.508mm
30mil	0.762mm
60mil	1.524mm

So it's very interesting that stack-up of 4 layers can be done in many different ways.

This 3-Layer high frequency PCB is built on 2 cores of RO4350B and one layer of copper is etched off, left 3 layers on.

3Layer Rogers PCB
Layer	Type	through hole		Material	Thickness
L1	Signal Layer1			Copper	0.035mm
L2			Core Pregreg	RO4350B Copper RO4450F	0.168mm 0.00mm 0.102mm
L3	Power Plain			Copper	0.035mm
			Core	RO4350B	1.524mm
L4	Signal Layer2			Cpper	0.035mm
Design cross Chart Total pressing thickness 1.90mm

The structure is one sheet of 60mil RO4350B plus 4mil RO4450F prepreg and combined 6.6mil RO4350B. The board is a square with 110mm x 110mm, with immersion gold finishes on pads. They're 20 pieces packed for shipment and used for wireless booster.
Following is the actual value in engineering manufacture.

3 Layer PCB,4 Pregregs,2 Cores
Layer	through hole	Material	Type	Original thickness(mil)	Thickness(mil)	Thickness(mm)	Residual copper rate	Inciude copper	DK
L1		Copper		1.377	1.377	0.035	100	0
		Core	RO4350B	60	60	1.524		0	3.48
L2		Copper		1.377	1.377	0.035	75	0
		PP	RO4450F	3.937	2.213	0.0562		0	3.52
L3		Copper		1.377	1.377	0.035	0	0
		Core	RO4350B	6.61	6.61	0.168		0	3.48
L4		Copper		1.377	1.377	0.035	100	0
Design cross Chart Total pressing thickness 1.88mm

Features and benefits
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) Reducing signal loss in high frequency application meets the development needs of communication technology;
3) Professional and experienced engineers check your production files
4) Hassle-free, one-to-one after-sales service;
5) UL, ISO14001, IAFT16949 certified factory.

Applications
Amplifier, Antenna combiner, Frequency converter, Trunk amplifier, RF module, Power splitter, Low Noise Block, 4G antenna


Parameter and data sheet

3 Layer High Frequency PCB Built On 60mil RO4350B and 6.6mil RO4350B with ENIG for Wireless Booster
PCB SIZE	110 x 110mm=1PCS
BOARD TYPE	Multilayer PCB
Number of Layers	3 layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 35µm(1 oz)+plate TOP layer
	RO4350B 60mil (1.524mm)
	copper ------- 35µm
	Prepreg RO4450F 4mil (0.102mm)
	copper ------- 0µm
	RO4350B 6.6mil (0.167mm)
	copper ------- 35µm(1oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	4 mil / 4 mil
Minimum / Maximum Holes:	0.4 mm / 3.5 mm
Number of Different Holes:	12
Number of Drill Holes:	124
Number of Milled Slots:	0
Number of Internal Cutouts:	NO
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RO4350B Tg280ºC, er<3.48, Rogers Corp
Final foil external:	1 oz
Final foil internal:	1 oz
Final height of PCB:	1.88 mm ±10%
PLATING AND COATING
Surface Finish	Immersion gold
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Our Quality Policy
Bicheng has developed series of management procedures and approaches to assure that PCBs are in compliance with the customers' requirements, inclusive of selection of the vendors, work in progress (WIP) inspection, outgoing delivery inspection and customer service etc.
  
Evaluation and Audit of Suppliers
Suppliers have to be evaluated by Bicheng. In addition, Bicheng will appraise and rank suppliers every year to guarantee the materials supplied are meeting Bicheng's requirements. Furthermore, Bicheng continuously develop suppliers and supervise them to improve their quality and environment management basing on the systems of ISO9001 & ISO14001.

Contract Evaluation
Bicheng shall review and verify customer's requirements to make sure that we have the capability to satisfy customers' requirements including specifications, delivery and other demands prior to accepting an order.

Making, audit and control of manufacturing data.
When customers' design data and specifications are provided to our market department, Bicheng has to verify all the requirements. Then, convert the design data into manufacturing data by CAM. Finally, a manufacturing instruction (MI) is generated according to the real manufacturing process and technologies for manufacturing department as the basis for actual fabrication. MI must be reviewed by independent engineers and QA engineers before issue.

Incoming Material Quality Control
All materials have to be inspected before warehousing. We established a series of strict inspection procedure and instruction to control the incoming materials. Furthermore, various precise inspecting instruments and apparatus guarantee the capability to judge the material good or not. We issue material with first in first out principle, and give out "alarm" for the material that will reach the shelf life to ensure the materials are used up before expiry.

Control of Production Process
Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.

Final Control and Inspection
All PCBs have to be gone through the open and short test as well as visual inspection after passed the specified physical tests. We own various advanced test equipment including customized, probe flying test machines to guarantee that each PCB is 100% tested.

Product Delivery Audit
We set up a dedicated FQA department to inspect the PCB products according to the customer's specifications and requirements by sampling. Qualified PCBs are going to be packed.

FQA also has to carry out a 100% audit of the warehouse packing and shipping products, including product number, customer number, product quantity, shipping address and so on prior to shipment.

Customer Service
We sets up a professional customer service team to proactively communicate with customers and timely deal with the customers' feedbacks. We highly focus on customers' needs and to understand customers' demands, timely to adjust the policy of customer service and PCB product requirements.