4 Layer PCB on 2.0mm Fr-4 with 1oz Each Layer and Immersion Gold

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0368-V3.68
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Surface Cu Thickness: 35 Um (1oz)
• Inner Iayer Cu Thicknes: 35 Um (1oz)
• Final Height of PCB: 2.0mm +/-0.2
• Surface Finish: Immersion Gold
• Solder Mask Color: Green
• Colour of Component Legend: White
• Mininum Trace (Mil): 8 Mil
• Minimum Gap(Mil): 8 Mil
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 162 x 289mm=2UP
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 4 layer PCB board built on FR-4 Tg135 substrate for the application of Wireless
Signal Booster. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold
on pads. The base material is from ITEQ supplying 2 up boards per panel. They're fabricated per
IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.

1.2 Features and benifits    
    
A. RoHS compliant and suitable for thermal reliability needs
B. Good oxidation resistance and good heat dissipation.
C. Micro-section and  thermal stress test
D. 8000 types of PCB per month
E. Money-saving, Worry-saving and Labor-saving
F. Quick turnaround prototype

1.3 Application
    
USB Hub,GPS Systems, Digital Electronics,Embedded Linux, 2000 Watt Inverter,Blue Tooth
Adapter, Laptop WiFi Antenna, 3G Router WiFi,GPS Truck Tracking,Cell phone transmission

1.4 Parameter and data sheet

Number of Layers	4
Board Type	Multilayer PCB
Board Size	162 x 289mm=2UP
Board Thickness	2.0mm +/-0.2
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	135ºC
PTH Cu thickness	≥20 um (See hole wall details)
Inner Iayer Cu thicknes	35 um (1oz)
Surface Cu thickness	35 um (1oz)
Solder Mask Type and Model No.	LPSM, PSR-2000GT600D
Solder Mask Supplier	TAIYO
Solder Mask Colour	Green
Number of Solder Masks	2
Thickness of Solder Mask	13um
Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	2
Mininum Trace (mil)	8 mil
Minimum Gap(mil)	8 mil
Surface Finish	Immersion gold
RoHS Required	Yes
Warpage	0.25%
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)	T1: 2.5
	T2: 2.2
	T3: 1.0
	T4: 0.9
	T5: 3.2

Pattern developing