General Profile
RO4003C High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminates(Not PTFE) designed for performance senstive, high volume commercial applications.Double sided and multilayer RO4003C PCB and hybrid RO4003C PCB are available in Bicheng company at present.Double sided RO4003c PCB with thickness 12mil(0.305mm), 20mil(0.508mm) and 32mil(0.813mm) are the bestsellers.We provide prototype runs, small batches and volume production services.
Advantages
1) Excellent high frequency performace due to low dielectric tolerance and loss;
2) Excellent dimensional stability.
3) Low thermal coefficient of dielectric constant;
4) Low Z-Axis expansion;
5) Low in-plane expansion coefficient;
6) Stable electrical properties verus frequency;
Applications
1) Attenuator, Automatic gate induction;
2) LNB's for direct broadcost satellites;
3) Microstrip antenna,spread spectrum;
4) Microstrip and cellular base statioin antennas and power amplifers;
5) RF identifications tags
6) Spread spectrum communications systems
7) Trunk amplifier, splitter module etc.
RO4350B & RO4003C Data Sheets
| Property |
Typical Value |
Direction |
Units |
Condition |
Test Method |
| |
RO4003C |
RO4350B |
|
|
|
|
| Dielectric Constant, εr Process |
3.38±0.05 |
3.48±0.05 |
Z |
- |
10 GHz/23ºC |
IPC-TM-650 2.5.5.5 Clampled Stripline |
| Dielectric Constant, εr Design |
3.55 |
3.66 |
Z |
- |
8 to 40 GHz |
Differntial Phase Length Method |
| Dissipation Factor Tan, δ |
0.0027 0.0021 |
0.0037 0.0031 |
Z |
- |
10 GHz/23ºC 2.5 GHz/23ºC |
IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr |
40 |
50 |
Z |
ppm/ºC |
minus 50ºC to 150ºC |
IPC-TM-650 2.5.5.5 |
| Volume Resistivity |
1.7 x 10¹º |
1.2 x 10¹º |
|
MΩ·CM |
COND A |
IPC-TM-650 2.5.17.1 |
| Surface Resistivity |
4.2 x 10^9 |
5.7 x 10^9 |
|
MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
| Electrical Strenghth |
31.8 (780) |
31.2 (780) |
Z |
KV/mm (V/mil) |
0.51mm (0.020") |
IPC-TM-650 2.5.6.2 |
| Tensile Modulus |
19650(2850) 19450(2821) |
16767 (2432) 14153 (2053) |
X Y |
Mpa(ksi) |
RT |
ASTM D638 |
| Tensile Strength |
139(20.2) 100(14.5) |
203(29.5) 130(18.9) |
X Y |
Mpa(ksi) |
RT |
ASTM D638 |
| Flexural Strength |
276 (40) |
255 (37) |
|
Mpa(kpsi) |
|
IPC-TM-650 2.4.4 |
| Dimensional Stability |
<0.3 |
<0.5 |
X,Y |
mm/m (mils/inch) |
after etch E2/150ºC |
IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion |
11 14 46 |
10 12 32 |
X Y Z |
ppm/ºC |
minus 55ºC to 288ºC |
IPC-TM-650 2.4.41 |
| Tg |
>280 |
>280 |
|
ºC TMA |
A |
IPC-TM-650 2.4.24 |
| Td |
425 |
390 |
|
ºC TGA |
|
ASTM D3850 |
| Thermal Conducvitity |
0.71 |
0.69 |
|
W/m/ºk |
80ºC |
ASTM C518 |
| Moisture Absorption |
0.06 |
0.06 |
|
% |
48 hrs immersion 0.060" sample Temperature 50ºC |
ASTM D570 |
| Density |
1.79 |
1.86 |
|
gm/cm³ |
23ºC |
ASTM D792 |
| Copper Peel Strength |
1.05 (6.0) |
0.88 (5.0) |
|
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 |
| Flammability |
N/A |
V-0 |
|
|
|
UL 94 |
| Lead-Free Process Compatible |
Yes |
Yes |
|
|
|
|
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