Printed Circuit Board 2 Layer Rigid PCB FR4 With min trace 7.8 mil
Commodity Introduction
This is a type of 2 layer PCB circuit board at 1.6mm thick for the application of Broadband Router.
The base laminate is from ITEQ FR-4, Green solder mask and White silkscreen from TAIYO on
board. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panel boards
are packed separately.
Parameters & Data Sheet
| Number of Layers |
2 |
| Board Type |
Double Sided PCB |
| Board Thickness |
1.6mm +/-0.16 |
| Board Material |
FR-4 |
| Board Material Supplier |
ITEQ |
| |
135ºC |
| |
| PTH Cu thickness |
≥20um (See hole wall details) |
| Inner Iayer Cu thicknes |
N/A |
| Surface Cu thickness |
35 um (1oz) |
| |
| Solder Mask Type and Model No. |
LPSM,SR-2000GT600D |
| Solder Mask Supplier |
TAIYO |
| Solder Mask Colour |
Green |
| Number of Solder Masks |
2 |
| Thickness of Solder Mask |
13um |
| |
| Type of Silkscreen Ink |
IJR-4000 MW300 |
| Supplier of Silkscreen |
Taiyo |
| Color of Silkscreen |
White |
| Number of Silkscreen |
1 |
| |
| Mininum Trace (mil) |
7.8mil |
| Minimum Gap(mil) |
6mil |
| |
| Surface Finish |
Lead Free HASL |
| RoHS Required |
Yes |
| Warpage |
0.28% |
| |
| Thermal Shock Test |
Pass, 288±5ºC,10 seconds, 3 cycles.
No delamination, no blistering. |
| Solderablity Test |
Pass, 255±5ºC,5 seconds Wetting Area Least 95% |
| Function |
100% Pass electrical test |
| Workmanship |
Compliance with IPC-A-600H & IPC-6012C Class 2 |
Microsection Hole Wall (um)
| Hole Wall Cu Thickness |
≥20 um |
Hole Wall Cu Roughness |
≤25.4 um |
| NO. |
A |
B |
C |
D |
E |
F |
AVE |
| 1 |
26.428 |
25.228 |
25.228 |
26.928 |
26.208 |
25.838 |
25.987 |
| 2 |
24.258 |
23.058 |
23.118 |
24.758 |
24.038 |
23.668 |
23.816 |
| 3 |
25.407 |
24.207 |
247.267 |
25.907 |
25.187 |
24.817 |
24.966 |
Outline dimension Unit: mm
| NO. |
Required Dimension (toerance) |
Actual dimension |
| 1 |
211.99 |
±0.15 |
212.08 |
212.02 |
211.94 |
212.09 |
| 2 |
201.54 |
±0.15 |
201.45 |
201.43 |
201.52 |
201.56 |
Drill Table (mm)
| NO. |
Requerment Dimension (tolerance) |
PTH/NPT |
| 1 |
0.700 |
±0.076 |
Y |
| 2 |
1.000 |
±0.076 |
Y |
| 3 |
1.600 |
±0.076 |
Y |
| 4 |
1.800 |
±0.076 |
Y |
| 5 |
1.930 |
±0.076 |
Y |
| 6 |
3.200 |
±0.076 |
Y |
| 7 |
3.500 |
±0.05 |
N |
Learn PCB and Buy PCB --- HASL
Hot air solder leveling is for short HASL, which is a common type of surface finish used on printed
circuit boards (PCBs). We dipped the PCBs (with exposed copper surfaces) into a bath of molten
solder, then remove the excess solder on PCB surface and in the holes by strong hot air(which
we call it HASL machine) to get a glossy layer of coating.
One is alloy of tin and lead. The temperature of smelting furnace for Tin/Led is about 240ºC.
Another one is pure tin, because lead is harmful to human body, EU has forbidden using tin/lead.
So the popular is pure tin or HASL Lead free. The temperature of smelting furnace for pure tin is
highly at 300ºC, and plus the operating environment, high temperature and high etching are great
harm on PCB itself. Due to its hot air generated, HASL has low planarity. It makes this surface
finish unsuitable for use with fine pitch components. It has hidden danger of board warp or twist
under high thermal stress. To avoid this disadvantages, high Tg material and PP are took into
consideration for some PCB user. But it also has excellent wetting during component soldering
and it can avoid copper corrosion. So it is also mostly used in single sided PCB, Double sided
PCB and some multilayer PCB.
Audited Supplier 
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