Tly-5z Printed Circuit Board of Shenzhen Bicheng Electronics PCB Design

• Customization: Available
• Structure: Multilayer Rigid PCB
• Dielectric: Tly-5z
• Model NO.: BIC-193-V2.1
• Material: Composites of Ceramic, PTFE and Woven Fiberglass
• Application: Aerospace Components
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.
• Laminate Thickness: 10mil 20mil 30mil and 60mil
• Layer Count: Single Sided, Double Sided, Multilayer PCB, Hybrid
• Solder Mask: Green, Black, Blue, Yellow, Red etc.
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

TLY-5Z High Frequency PCB 60mil 30mil 20mil and 10mil Taconic RF PCB with Immersion Gold
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description
Taconic TLY-5Z high-frequency PCBs are advanced composite materials engineered for demanding applications, particularly in aerospace where lightweight performance is critical. Combining ceramic, PTFE, and woven fiberglass reinforcement, TLY-5Z  laminate achieves exceptional dimensional stability while maintaining a low-density profile. Its unique composition results in significantly reduced Z-axis expansion compared to traditional PTFE-rich composites, along with enhanced thermal stability-exhibiting just half the thermal expansion of standard PTFE laminates. TLY-5Z material's superior mechanical properties enable improved drilling performance and reliable operation through repeated thermal cycling, making it an optimal solution for high-frequency applications requiring both precision and durability.

 

 

Benefits:
Low Z Axis CTE
Plated through hole stability
Low density (1.92 g/cm3)
Attractive price/performance ratio
Excellent peel strength
Compatible with flat copper
 

Typical Applications:
Aerospace components
Low weight antennas for aircraft
RF passive components

Our PCB Capability  (TLY-5Z)

PCB Capability (TLY-5Z)
PCB Material:	Composites of Ceramic, PTFE and Woven Fiberglass
Designation:	TLY-5Z
Dielectric constant:	2.20 +/- 0.04 (10GHz)
Dissipation Factor	0.0015 (10GHz)
Layer count:	Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	1oz (35 µm), 2oz (70µm)
Laminate thickness:	10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm  )
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold plated etc..

 

About Us
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 20 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.
  
We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We also actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.
  
Our PCBs are used for a variety of purposes, including, but not limited to, computer networking, safety and surveillance, power supply, telecommunication, automotive electronics, medical apparatus and instruments, national defense and industrial equipment etc.

Appendix: Typical Values of TLY-5Z

TLY-5Z Typical Values
Property	Test Method	Unit	Value	Unit	Value
Dk @ 1.9 GHz	IPC-650 2.5.5.5.1 Mod.		2.20+/- 0.04		2.20+/- 0.04
Df @ 1.9 GHz	IPC-650 2.5.5.5.1 Mod.		0.001		0.001
Df @ 10 GHz	IPC-650 2.5.5.5.1 Mod.		0.0015		0.0015
Tc(D)K (-55 ~150°C)	IPC-650 2.5.5.6 Mod.	ppm/°C	-72	ppm/°C	-72
Dielectric Breakdown Voltage	IPC-650 2.5.6	kV	45	kV	45
Dielectric Strength	IPC-650 2.5.6.2	V/mil	770	V/mm	30,315
Moisture Absorption	IPC-650 2.6.2.1	%	0.03	%	0.03
Peel Strength (1 oz. copper)	IPC-650 2.4.8	lbs./inch	7	N/mm	1.3
Volume Resistivity	IPC-650 2.5.17.1	Mohms/cm	10^9	Mohms/cm	10^9
Surface Resistivity	IPC-650 2.5.17.1	Mohms	10^8	Mohms	10^8
Tensile Strength (MD)	IPC-650 2.4.18.3	psi	9137	N/mm2	63
Tensile Strength (CD)	IPC-650 2.4.18.3	psi	9572	N/mm2	66
Tensile Modulus (MD)	IPC-650 2.4.18.3	psi	182,748	N/mm2	1260
Tensile Modulus (CD)	IPC-650 2.4.18.3	psi	165,344	N/mm2	1140
Elongation (MD)	IPC-650 2.4.18.3	%	6	%	6
Elongation (CD)	IPC-650 2.4.18.3	%	6.9	%	6.9
Flex Strength (MD)	ASTM D790	psi	10,300	N/mm2	71
Flex Strength (CD)	ASTM D790	psi	11,600	N/mm2	80
Flex Modulus (MD)	ASTM D790	psi	377,100	N/mm2	2600
Flex Modulus (CD)	ASTM D790	psi	432,213	N/mm2	2980
Dimensional Stability (MD)	IPC-650 2.4.39 (Bake)	% (10 mil)	-0.05	% (30 mil)	-0.05
Dimensional Stability (CD)	IPC-650 2.4.39 (Bake)	% (10 mil)	-0.17	% (30 mil)	-0.11
Dimensional Stability (MD)	IPC-650 2.4.39 (Stress)	% (10 mil)	-0.07	% (30 mil)	-0.07
Dimensional Stability (CD)	IPC-650 2.4.39 (Stress)	% (10 mil)	-0.22	% (30 mil)	-0.14
Density (Specific Gravity)	IPC-650 2.3.5	g/cm3	1.92	g/cm3	1.92
Specific Heat	IPC-650 2.4.50	J/g°C	0.95	J/g°C	0.95
Thermal Conductivity	IPC-650 2.4.50	W/M*K	0.2	W/M*K	0.2
CTE (x-y) (50 - 150°C)	IPC-650 2.4.41	ppm/ºC	30-40	ppm/ºC	30-40
CTE (z) (50 - 150°C)	IPC-650 2.4.41	ppm/ºC	130	ppm/ºC	130
Hardness	ASTM D2240 (Durometer)	-	68	-	68
UL-94 Flammability Rating	UL-94		V-0		V-0