Rogers RO3003 6-Layer RF PCB Bonded by Fastrise-28 Prepreg for High Speed Signal Transmission

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-815-V8.15
• Material: PTFE
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Glass Reinforced Hydrocarbon
• Model: PCB
• Transport Package: Vacuum
• Specification: 45 x 47mm=1PCS
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg for High Speed Signal Transmission
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices.  The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/ºC. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/ºC, which provides exceptional plated through-hole reliability, even in severe environments.

Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers

Data sheet of RO3003

RO3003 Typical Value
Property	RO3003	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.0±0.04	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.001	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-3	Z	ppm/ºC	10 GHz -50ºCto 150ºC	IPC-TM-650 2.5.5.5
Dimensional Stability	0.06 0.07	X Y	mm/m	COND A	IPC-TM-650 2.2.4
Volume Resistivity	10^7		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	10^7		MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	930 823	X Y	MPa	23ºC	ASTM D 638
Moisture Absorption	0.04		%	D48/50	IPC-TM-650 2.6.2.1
Specific Heat	0.9		j/g/k		Calculated
Thermal Conductivity	0.5		W/M/K	50ºC	ASTM D 5470
Coefficient of Thermal Expansion (-55 to 288ºC)	17 16 25	X Y Z	ppm/ºC	23ºC/50% RH	IPC-TM-650 2.4.4.1
Td	500		ºC TGA		ASTM D 3850
Density	2.1		gm/cm^3	23ºC	ASTM D 792
Copper Peel Stength	12.7		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

Taconic company's FastRise-28 semi-solidified sheet is specially designed for high-speed digital signal transmission applications and millimeter-wave RF multi-layer printed board manufacturing. It is matched with other microwave substrate materials of TACONIC company to manufacture multilayer microwave printed circuit boards.

FastRise-28 semi-solidified sheet can meet the design requirements of stripline structure with low dielectric loss. The thermosetting properties of the adhesive material make it meet the design requirements of multiple laminated manufacturing. In addition, a large number of ceramic powder fillers are selected in the composition of the semi-solidified sheet, which makes the dimensional stability of the corresponding products very good. Because of its high performance thermosetting resin, it shows good bonding effect on copper foil and some PTFE materials.

The main properties of this adhesive sheet material are shown in the table below.

FastRise-28 (FR-28) Typical Value
Property	Value	Direction	Units	Condition	Test Method
Dielectric Constant,ε	2.78	-	-	10 GHz	IPC-TM-650 2.5.5.5.1
Dissipation Factor,tanδ	0.0015	-	-	10 GHz	IPC-TM-650 2.5.5.5.1
Water Absorption	0.08		%		IPC TM-650 2.6.2.1
Dielectric breakdown voltage	49		KV		IPC TM-650 2.5.6
Dielectric strength	1090		V/mil		ASTM D 149
Volume Resistivity	8.00 x 10^8		MΩ/cm		IPC-TM-650 2.5.17.1
Surface Resistivity	3.48 x 10^8		MΩ		IPC-TM-650 2.5.17.1
Tg	188		ºC		ASTM E 1640
Tensil strength	1690	X	psi		ASTM D 882
	1480	Y	psi
Tensil modulus	304	X	psi		ASTM D 882
	295	Y	psi
Density	1.82		gm/cm³		ASTM D-792 Method A
Td	709		°F		IPC TM-650 2.4.24.6
Peel Strength	7		lbs/in		IPC-TM-650 2.4.8
Thermal Conductivity	0.25		W/mk		ASTM F433
Coefficient of Thermal Expansion	59 70 72	X Y Z	ppm/ºC		IPC-TM-650 2.4.41
Hardness	68		Shore D		ASTM D 2240

More FastRise Prepregs

fastRise Prepreg
Product	Carrier film                (mil)	Film Elognation          (%)	Pressed Thickness (mil)	Pressed Thickness (mil)	Pressed Thickness (mil)	Nominal DK              (Min. / Max.)                 (10 GHz)	Typical Flow (%)
FR-26-0025-60	1	200-300	2.7	1.3	1	2.58	17
FR-27-0030-25	2.3	30-60	3.5	2.1	Not recommended	2.74                          (2.71 / 2.78)	4
FR-27-0035-66	1	200-300	3.7	2.5	2.1	2.7	36
FR-27-0040-25	3	30-60	4.9	3.7	Not recommended	2.74	4
FR-28-0040-50	1	200-300	4.9	3.7	3.5	2.81                                (2.80 / 2.82)	23
FR-27-0042-75	2.3	30-60	5.16	3.96	3.5	2.73	35
FR-27-0045-35	3	30-60	5.8	4.6	4.2	2.75                                (2.73 / 2.77)	13
FR-27-0050-40	3	30-60	6.1	5.5	4.9	2.76                                 (2.71 / 2.80)	23
				0.5 oz Cu. 50% removal	1 oz. Cu. 50% removal

Refrigeration
FastRise is a non-reinforced prepreg that is manufactured between release liners so that individual plies of FastRise do not stick together. The adhesive layer on the surface of the PTFE/cereamic film can be quite tacky especially for freshly manufactured material. It is recommended to refrigerate FastRise prior to lamination. Continuous refrigeration is always a good practice for storing prepregs as this will extend the shelf lile. However, because FastRise can be quite tacky, FastRise should be refrigerated as close to 4ºC as possible. FastRise will stiffen up and will separate from the release liners a lot easier.

Lamination
Various laminate cores are used in conjunction with FastRise prepreg to produce multilayer boards for the RF/digital/ATE multilayer markets. FastRise when used in a symmetrical board design, will result in optimum electrical and mechanical performance. Because of the thermoset properties of the bonding agent, multiple bonding cycles can be achieved without worry of delamination. In addition, the recommended press temperature of 215.5ºC is within reach of most boards houses.

Here's a type of RF PCB built on Rogers RO3003 core bonding by FastRise-28. It is 6-layer stack-up with 1oz copper on each layer. Finished board will be 1.2mm thick, pads are immersion gold plated. There's 2+N+2 steps blind via from layer 1 to layer 4. See the stack-up as follows.

6 Layers RF PCB,RO303+RF-28
Layer	Type	through hole	blind via	Material	Thickness
L1	Signal Layer1			Copper	0.035mm
				RO3003	0.254mm
L2	GND Plain			Copper	0.035mm
				Pregregs Fast Rise -28	0.104mm
L3	Power Plain			Copper	0.035mm
				RO3003	0.254mm
L4	Signal Layer2			Copper	0.035mm
				Pregregs Fast Rise -28	0.104mm
L5	Power Layer			Copper	0.035mm
				RO3003	0.104mm
L6	Signal			Copper	0.035mm
Design cross section Chart Total pressing thickness 1.18mm