Multilayer PCB High Tg170 FR-4 6 Layer with Green Solder Mask and Gold for Codec
Application
Commodity Introduction
This is a type of FR-4 PCB for the application of Codec Application. It's a 6 layer board at 1.6mm
thick. The base laminate is from ShengYi, Solder mask and silkscreen from Nan Ya and Taiyo. It's
fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed
separately.
Parameters & Data Sheet
| Item |
Description |
Requirement |
Actual |
| Laminate |
Laminate Type |
FR4 |
FR4 |
| Supplier |
SHENGYI |
SHENGYI |
| Tg |
TG 170 |
TG 170 |
| Finished thickness |
1.57+/--0.15 mm |
1.62 mm |
| Plating Thickness |
PTH Cu thickness |
20 um |
22.3 um |
| Inner layer Cu Thickness |
35 um |
35 um |
| Surface Cu thickness |
35 um |
35.5 um |
| Solder Mask |
Material type |
LP-4G G-05 |
LP-4G G-05 |
| Supplier |
Nan Ya |
Nan Ya |
| Color |
Green |
Green |
| Single / both sides |
Both Sides |
Both Sides |
| S/M thickness |
>= 10.0 um |
28.73 um |
| 3M tape test |
NO Peel Off |
no peel off |
| Legend |
Material type |
S-380W |
S-380w |
| Supplier |
Tai yo |
Tai yo |
| Color |
White |
White |
| Location |
CS |
CS |
| 3M tape test |
No peel off |
no peel off |
| Circuit |
Trace Width (mm) |
0.25+/-20%mm |
0.255mm |
| Spacing (mm) |
0.38+/- 20%mm |
0.376 mm |
| Identification |
UL mark |
94V-0 |
94V-0 |
| Company Logo |
QM |
QM |
| Date code |
1017 |
1017 |
| Mark location |
CS |
CS |
| Surface Treatment |
ENIG |
Nickel |
100 u" |
134.6 u" |
| Gold |
1.2 u" |
1.28 u" |
| Reliabilty Tests |
Thermal shock test |
288±5ºC,10sec,
3 cycles |
NO Discolor,
NO Delamination |
| solder abllity test |
235±5ºC, |
100% wetting |
| Function |
Electrioal Test |
100% |
pass |
| Standard |
IPC-A 600H class 2,
IPC_6012C CLASS 2 |
|
100% |
Pass |
| Appearance |
Visual inspection |
100% |
Pass |
| warp and twist |
<= 0.75% |
0.21% |
| Others |
V-Cut thickness |
0.4±0.1mm |
0.39mm |
| Angle |
30+/- 5 |
30º |
Finished dimension (unit: mm): including v-cut
| No |
Required |
Actual Dimension |
| 1 |
128 |
127.94 |
127.87 |
127.94 |
127.96 |
12794 |
| 2 |
190 |
189.95 |
189.89 |
189.96 |
189.96 |
189.95 |
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
| No |
Required |
PTH/NPTH |
Actual Dimension |
| 1 |
0.9 |
Y |
0.975 |
0.925 |
0.900 |
0.000 |
| 2 |
1.02 |
Y |
1.075 |
1.000 |
0.975 |
1.050 |
| 3 |
1.3 |
Y |
1.300 |
1.375 |
1.325 |
1.300 |
| 4 |
3.05 |
Y |
3.050 |
3.050 |
2.975 |
3.100 |
| 5 |
3.5 |
N |
3.475 |
3.550 |
3.450 |
3.550 |
Learn PCB and Buy PCB
Image Transfer
As PCBs become more complex, patterns (pads and tracks) are becoming finer and finer. It is
very crucial to transfer the image without any noticeable distortion. The finished image will act
as a plating resist. This is usually based on a dry-film resist of a certain thickness that matches
the plating thickness.
The most commonly used track width is about 0.102 mm (4 mils) which could be regarded as
the standard width. However, widths of 0.076 mm (3 mils) are also in use, and some
Chinese PCB manufacturers operate with track widths down to 0.050 mm (2 mils). But the PCB
designer should not be tempted by track widths of 0.076 mm (3 mils) or smaller because
the manufacturing yield becomes lower and the board price, correspondingly, higher.
The purpose of image transfer is to cover those areas of the board that are not to be plated with
copper, tin/lead or pure tin, with a plating resist, and to leave the pattern open for electroplating.
With plated-through-hole boards, image transfer is performed by means of a photopolymer
dry-film process consists of the following steps:
LaminationRegistrationExposureDevelopingLaser Direct Imaging
Audited Supplier 
){kind=link}