Double-Layer F4btm320 Circuit Board PCB of Shenzhen Designer

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-111-V2.1
• Material: PTFE / Glass Fiber Cloth / Nano-Ceramic Filler
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: F4btm320
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Wangling
• Layer Count: Double-Layer
• Copper Weight: 2oz Copper
• Thickness: 1.27mm
• Surface Finish: Immersion Gold
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 110mm x 76 mm =1up
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

1.27mm F4BTM320 High Frequency PCB with 2oz Copper in  Precise Circuit Design
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Brief Introduction
This PCB features a size of 110mm x 76mm and is designed as a double-sided layout with two layers. It accommodates surface mount components while excluding through-hole components. The layer stackup includes a top layer of 70 µm (2 oz) copper with starting 1oz plating, supported by a robust F4BTM320 core material of 1.27mm thickness, and a bottom layer of the same copper specifications for consistent performance.

The PCB allows for a minimum trace width of 5 mil and a minimum spacing of 9 mil, facilitating precise circuit design. The surface finish is Immersion Gold, ensuring excellent solderability and durability. Both the top and bottom sides are coated with a black solder mask, providing protection and aesthetic appeal, while white silkscreen is applied to the top side for clear labeling and identification.

Here are details in table below.

F4BTM320 High Frequency PCB 2oz Copper 1.27mm Substrates With Immersion Gold
PCB SIZE	110mm x 76 mm =1up
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 70 um(1 oz+plate) TOP layer
	F4BTM320 - 1.27mm
	copper ------- 70 um(1 oz + plate)  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	5 mil / 9 mil
Minimum / Maximum Holes:	0.35 mm / 1.0 mm
Number of Different Holes:	4
Number of Drill Holes:	61
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	F4BTM320 DK3.2
Final foil external:	2 oz
Final foil internal:	N/A
Final height of PCB:	1.4 mm
PLATING AND COATING
Surface Finish	Immersion Gold
Solder Mask Apply To:	Top side & Bottom Side
Solder Mask Color:	Black
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Top Side
Colour of Component Legend	White
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.35mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

F4BTM High Frequency Laminates
F4BTM series laminates are made by scientifically formulating fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. The series is based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics. Optional copper foil is available with ED copper in thicknesses of 0.5 oz, 1 oz, 1.5 oz, and 2 oz.
 

Features & Benefits
DK 2.98-3.5 optional
Adding ceramic improves performance
Excellent PIM indicators
Rich thickness ranging 0.254mm to 12mm
Diversified size 460mm x 610mm to 914mm x 1220mm
Cost saving
Commercialization for mass production
High cost performance
Anti radiation
Low exhaust
 

Our PCB Capability (F4BTM)

PCB Capability (F4BTM)
PCB Material:	PTFE / glass fiber cloth / Nano-ceramic filler
Designation                        (F4BTM )	F4BTM	DK (10GHz)	DF (10 GHz)
	F4BTM298	2.98±0.06	0.0018
	F4BTM300	3.0±0.06	0.0018
	F4BTM320	3.2±0.06	0.0020
	F4BTM350	3.5±0.07	0.0025
Layer count:	Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness               (or overall thickness)	0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

Data Sheet (F4BTM) 

Product Technical Parameters				Product Models & Data Sheet
Product Features		Test Conditions	Unit	F4BTM298	F4BTM300	F4BTM320	F4BTM350
Dielectric Constant (Typical)		10GHz	/	2.98	3.0	3.2	3.5
Dielectric Constant Tolerance		/	/	±0.06	±0.06	±0.06	±0.07
Loss Tangent (Typical)		10GHz	/	0.0018	0.0018	0.0020	0.0025
		20GHz	/	0.0023	0.0023	0.0026	0.0035
Dielectric Constant Temperature Coefficient		-55 º~150ºC	PPM/ºC	-78	-75	-75	-60
Peel Strength		1 OZ F4BTM	N/mm	>1.6	>1.6	>1.6	>1.6
		1 OZ F4BTME	N/mm	>1.4	>1.4	>1.4	>1.4
Volume Resistivity		Standard Condition	MΩ.cm	≥1×10^7	≥1×10^7	≥1×10^7	≥1×10^7
Surface Resistivity		Standard Condition	MΩ	≥1×10^6	≥1×10^6	≥1×10^6	≥1×10^6
Electrical Strength (Z direction)		5KW,500V/s	KV/mm	>26	>30	>32	>32
Breakdown Voltage (XY direction)		5KW,500V/s	KV	>34	>35	>40	>40
Coefficientof Thermal Expansion	XY direction	-55 º~288ºC	ppm/ºC	15,16	15,16	13,15	10,12
	Z direction	-55 º~288ºC	ppm/ºC	78	72	58	51
Thermal Stress		260ºC, 10s,3 times		No delamination	No delamination	No delamination	No delamination
Water Absorption		20±2ºC, 24 hours	%	≤0.05	≤0.05	≤0.05	≤0.05
Density		Room Temperature	g/cm3	2.25	2.25	2.20	2.20
Long-Term Operating Temperature		High-Low Temperature Chamber	ºC	-55~+260	-55~+260	-55~+260	-55~+260
Thermal Conductivity		Z direction	W/(M.K)	0.42	0.42	0.50	0.54
PIM		Only applicable to F4BTME	dBc	≤-160	≤-160	≤-160	≤-160
Flammability		/	UL-94	V-0	V-0	V-0	V-0
Material Composition		/	/	PTFE, Fiberglass Cloth, nano-ceramics F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.