4 Layer PCB Built on Tg135 Fr-4 with Black Color

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-811-V8.11
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Board Thick
1.6mm
Surface Finish
Immersion Gold
out Layer Copper
1 Oz
Final Foil Internal
1 Oz
Solder Mask Color
Black
Silkscreen Color
No
Minimum Trace and Space
7.8 Mil / 6.2 Mil
Minimum / Maximum Holes
0.8mm / 3.2 mm
Via
Minimum Size 0.8mm.
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
141.05*228.09=4PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000 PCS/ Month

Product Description

1.1 General description

This is a type of multilayer PCB built on FR-4 substrate with Tg 135°C for the application of
Bluetooth Headphones. It's standard 1.60 mm thick, no silkscreen. Black solder mask covers both
sides and immersion gold are on pads. The base material is used from ITEQ IT-158, entire board
supplying 21 PCBs per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data.
Each 25 panels are packed for shipment. 

1.2 Features and benifits 
   
A. Excellent dimensionaly stability;
B. Excellent surface planarity, helpful for PCBs with BGA packages to reduce failure rate during
    assembly and soldering;
C. Improved the speed of signal transmission;
D. 30000 square meter month capability;
E. 8000 types of PCB per month;
F. On-time service;
G. More than 15 years of PCB experience;
H. Focus on low to medium volume production;

1.3 Application

Security Systems, GPS Systems, 8 Port Gigabit Switch, Embedded Linux, GPS Data Logger, Blue
Tooth Adapter, Inverter Ups, 4G Router WiFi, Computers 

1.4 Parameter and data sheet
PCB SIZE 141.05 x 228.09mm=4PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
PP 7628 + PP 1080
copper ------- 35um(1oz) MidLayer 1
FR-4 1.0 mm
copper ------- 35um(1oz) MidLayer 2
PP 7628 + PP 1080
copper ------- 18um(0.5oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 9.6 mil / 8.9 mil
Minimum / Maximum Holes: 0.8mm / 3.2 mm
Number of Different Holes: 2
Number of Drill Holes: 71
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  FR-4 Tg135ºC, er<5.4.IT-158,  ITEQ Supplied
Final foil external:  1 oz
Final foil internal:  1 oz
Final height of PCB:  1.6 mm ±10%
PLATING AND COATING  
Surface Finish Immersion gold (21.5% ) 0.05µm over 3µm nickel
Solder Mask Apply To:  TOP and Bottom, 13 micron Minimum
Solder Mask Color:  Black, KSM-6189BK31, KUANGSHUN Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, v-cut
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.8mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


 

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