1.1 General description
This is a type of high multilayer PCB built on FR-4 substrate with Tg 170°C for the application
of Industrial controls with 24 layer copper track. It's 3.7 mm thick with white silkscreen(Taiyo)
on green solder mask (Taiyo) and immersion gold on pads. This is also an impedance controlled
PCB with single-end impedance of 50 ohm and differential impedance of 100 ohm. The base
material is from ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using
supplied Gerber data. Each 10 panels are packed for shipment.
1.2 Features and benifits
a. Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and
automobile application.
b. Long storage time ( It can be stored for more than 1 year in vacuum bag)
c. The signal lines form a constant low impedance to the ground
d. Micro-section and thermal stress test
e. 16000 square meter workshop
f. Small quantity order is accepted
g. ISO9001, ISO14001, TS16949, UL Certified
1.3 Application
Transmitter, Inverter Generator, GSM Modem, 3G WiFi Router, AC To DC Adapter, Phase
Shifter, AC To DC Converter Circuit, Embedded Controller, Broadband Wireless Solutions, Hard
drives
1.4 Parameter and data sheet
| PCB SIZE |
400 x 212mm=1PCS |
| BOARD TYPE |
Multilayer PCB |
| Number of Layers |
24 Layers |
| Surface Mount Components |
YES |
| Through Hole Components |
YES |
| LAYER STACKUP |
TOP LAYER 0.018mm+plating Layer 1 |
| Prepreg 0.1016mm |
| PLANE 1 --- 0.035mm Layer 2 |
| CORE FR4 0.1016mm |
| GROUND 1 - - 0.035mm Layer 3 |
| Prepreg 0.127mm |
| SIGNAL 1 --- 0.018mm |
| CORE FR4 0.1524mm |
| PLANE 2 --- 0.035mm |
| Prepreg 0.1016mm |
| GROUND 2 --- 0.035mm |
| CORE FR4 0.127mm |
| SIGNAL 2 --- 0.018mm |
| Prepreg 0.1524mm |
| PLANE 3 --- 0.035mm |
| CORE FR4 0.1016mm |
| PLANE,GROUND 7 --- 0.035mm |
| Prepreg 0.127mm |
| SIGNAL 3 --- 0.018mm |
| CORE FR-4 0.1524mm |
| GROUND 3 --- 0.035mm |
| Prepreg 0.127mm |
| SIGNAL 4 --- 0.018mm |
| CORE FR4 0.1524mm |
| PLANE 4 --- 0.035mm |
| Prepreg 0.1016mm |
| GROUND 4 --- 0.035mm |
| CORE FR4 0.1016mm |
| SIGNAL 5 --- 0.018mm |
| Prepreg 0.1524mm |
| SIGNAL 6 --- 0.018mm |
| CORE FR4 0.1016mm |
| PLANE 5 --- 0.035mm |
| Prepreg 0.1016mm |
| GROUND 5 --- 0.035mm |
| CORE FR4 0.1524mm |
| SIGNAL 7 --- 0.018mm |
| Prepreg 0.127mm |
| PLANE 6 --- 0.035mm |
| CORE FR4 0.1524mm |
| SIGNAL 8 --- 0.018mm |
| Prepreg 0.127mm |
| POWER, RROUND 8 --- 0.035mm Layer 22 |
| CORE FR4 0.1016mm |
| GROUND 6 --- 0.035mm Layer 23 |
| Prepreg 0.1016mm |
| BOTTOM LAYER --- 0.018mm + plating Layer 24 |
| TECHNOLOGY |
|
| Minimum Trace and Space: |
5 mil / 5 mil |
| Minimum / Maximum Holes: |
0.36 /3.2mm |
| Number of Different Holes: |
9 |
| Number of Drill Holes: |
9117 |
| Number of Milled Slots: |
0 |
| Number of Internal Cutouts: |
0 |
| Impedance Control: |
Yes, signal layer of all 8 copper layers,
50 OHM Impedance Controlled for
single ended & 100 OHM for Differential routes |
| Number of Gold finger: |
0 |
| BOARD MATERIAL |
|
| Glass Epoxy: |
FR-4 Tg170ºC, er<5.4.IT-180, ITEQ Supplied |
| Final foil external: |
1oz |
| Final foil internal: |
1oz |
| Final height of PCB: |
3.7mm ±0.10% |
| PLATING AND COATING |
|
| Surface Finish |
Immersion gold (29.1% ) 0.05µm over 3µm nickel |
| Solder Mask Apply To: |
TOP and Bottom, 12micron Minimum |
| Solder Mask Color: |
Green, PSR-2000 KX700G, Taiyo Supplied. |
| Solder Mask Type: |
LPSM |
| CONTOUR/CUTTING |
Routing |
| MARKING |
|
| Side of Component Legend |
TOP and Bottom. |
| Colour of Component Legend |
White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: |
Marked on the board in a conductor and
leged FREE AREA |
| VIA |
Via hole filling at BGA required. |
| FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE |
|
| Outline dimension: |
0.0059" |
| Board plating: |
0.0029" |
| Drill tolerance: |
0.002" |
| TEST |
100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA |
Worldwide, Globally. |
Audited Supplier 
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