General profile
High frequency printed circuit board or microwave PCB refers to the printed circuit board made on the high frequency (microwave) substrate copper clad plate. The common types are: Double-sided board, multilayer board and mixed structure.
Mixed structure includes high performance special substrate, PP sheet + ordinary performance board and PP sheet mixed pressing board; high frequency substrate + ordinary FR4 substrate; high frequency substrate + metal base etc.
Just as its name implies, high frequency is that the frequency is relatively high, generally refers to the frequency of >=300 MHz (i.e. wave length <=1m), that is, the usual radio frequency band. The electromagnetic wave of frequency >=1GHz is called microwave.
Advantages
1) The characteristic of low dielectric loss makes the signal loss at a lower level, which makes the signal transmission of the whole equipment excellent;
2) Low water absorbability influences dielectric constant and dielectric loss less at damp;
3) The temperature coefficient of dielectric constant is among the lowest of any circuit board material, making it ideal for temperature sensitive applications;
4) Stable electrical coefficient of dielectric constant;
5) Superior corrosion resistance;
6) The dielectric constant (DK) is low and stable, so the signal transmission is good without delay;
Typical frequencies for wireless applications:
* Current mobile: 0.9GHz - 2GHz
* 3G systems: 2.5GHz
* Bluetooth: 2.5GHz
* GPS: 12.6GHz
* LMDS: 24GHz and 40GHz
* Automotive: 77GHz
Market: RFID, Wireless communications, base station and antenna, amplifier, military products, consumer electronics.
Design For Manufacture
This manufacturability guide provides an overview of various areas that printed circuit board designer may take into consideration on the fabrication possibility, manufacturing cost and reliability of their products. This DFM is divided into 6 parts for our readers. This is the section V.
| Serial NO. |
Procedure |
Item |
Manufacturing capability |
| Large volume (S<100 m²) |
Middle volume (S<10 m²) |
Prototype(S<1m²) |
|
| 66 |
Contour process |
Method of contour process |
CNC milling, V-CUT, Break-out tap, break-out holes, Punching |
| 67 |
Minimum router |
0.8mm |
| 68 |
Min.tolerance of contour |
±0.15mm |
±0.13mm |
±0.1mm |
| 69 |
Min.distance of milling contour(no copper exposure) |
12mil |
10mil |
8mil |
| 70 |
Angle of V-CUT |
20,30,45,60 ±5 degree |
| 71 |
Degree of symmetry of V-CUT |
±6mil |
±5mil |
±4mil |
| 72 |
Tolerance of residual thickness of V-CUT |
±6mil |
±5mil |
±4mil |
| 73 |
Tolerance of Chamfer angle of Gold finger |
±5 degree |
±5 degree |
±5 degree |
| 74 |
Tolerance of residual thickness of bevel edge of gold finger |
±5mil |
±5mil |
±5mil |
| 75 |
Min radius of inner corner |
0.4mm |
| 76 |
Min. distance from edge to V-Cut (no copper exposure) |
18mil (1.6mm Thick, 20 degree V-groove cutter) |
14mil(1.6mm Thick, 20 degree V-groove cutter) |
12mil (1.6mm Thick, 20 degree V-groove cutter) |
| 77 |
20mil (1.6mm Thick, 30 degree V-groove cutter) |
18mil (1.6mm Thick, 30 degree V-groove cutter) |
16mil (1.6mm Thick, 30 degree V-groove cutter) |
| 78 |
24mil (1.6mm Thick, 45 degree V-groove cutter) |
22mil (1.6mm Thick, 45 degree V-groove cutter) |
20mil (1.6mm Thick, 45 degree V-groove cutter) |
| 79 |
30mil (1.6mm Thick, 60 degree V-groove cutter) |
28mil (1.6mm Thick, 60 degree V-groove cutter) |
26mil (1.6mm Thick, 60 degree V-groove cutter) |
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