F4bm265 Double-Sided 3.0mm PCB: High-Frequency Board with 5/5 Mils Trace/Space for RF Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: F4bm265
• Model NO.: BIC-1212-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

F4BM265 Double-Sided 3.1mm PCB: High-Frequency Board with 5/5 Mils Trace/Space for RF Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)



1. Product Overview
This robust 2-layer PCB utilizes Wangling's advanced F4BM265 laminate to deliver exceptional performance for demanding RF and microwave applications. With its 3.1mm thickness and black solder mask finish, this board is engineered for phase-sensitive antennas, radar systems, and satellite communications equipment.

Key Advantages:
Enhanced Electrical Performance: Lower dielectric loss compared to standard F4B265

Superior Thermal Stability: Operates from -55°C to +288°C

Precision Manufacturing: 5/5 mils trace/space capability

Reliable Construction: IPC-Class 2 certified with 100% electrical testing

Cost-Effective Alternative: Domestic replacement for imported RF materials


2. Technical Specifications

Parameter	Specification
Base Material	F4BM265 PTFE composite
Dimensions	45.33 × 50.2mm (±0.15mm)
Layer Count	2
Thickness	3.1mm
Copper Weight	1oz (70μm after plating)
Min Trace/Space	5/5 mils
Min Hole Size	0.5mm
Surface Finish	Lead-Free HASL
Solder Mask	Black (Top only)
Silkscreen	White (Top only)

Layer Stackup:
Top Layer: 70μm copper + black solder mask

Core: 3.0mm F4BM265 dielectric

Bottom Layer: 70μm copper (no mask)


3. Performance Characteristics

Material Properties
Dielectric Constant: 2.65 @10GHz

Loss Tangent: 0.0013 @10GHz

CTE: 14/17/142 ppm/°C (X/Y/Z)

Moisture Absorption: ≤0.08%

Flammability: UL94 V-0 compliant

Thermal Stability: -100ppm/°C Dk variation (-55°C to +150°C)



Design Specifications
Components: 12
Pads: 37 (21 thru-hole, 16 SMT)
Vias: 25
Nets: 2
Artwork: Gerber RS-274X
Quality Standard: IPC-Class 2


4. Recommended Applications
Radar Systems: Phased array and surveillance radar

5G Infrastructure: Base station antennas

Satellite Comms: LNB and transceiver circuits

RF Components: Power dividers, couplers, phase shifters

Military Electronics: EW and guidance systems


5. Why Choose This PCB?
1. Optimized RF Performance: Low-loss PTFE formulation
2. Robust Construction: 3.1mm thickness for mechanical stability
3. Precision Manufacturing: Tight 5/5 mils tolerances
4. Cost Efficiency: Domestic alternative to imported materials
5. Reliable Quality: Full electrical testing and IPC certification


Available Options:
F4BME265 version with RTF copper for PIM-sensitive applications

Custom impedance control

Alternate surface finishes (ENIG, Immersion Silver)

Special testing (PIM, HV, etc.)

Tags:
F4BM265 PCB, 3.1mm RF Board, PTFE Circuit Board, 5/5 Mils Trace Space, Black Solder Mask PCB, Microwave Circuit Board, Radar System PCB, Phase Array Antenna Board, Satellite Communication PCB, IPC-Class 2 Compliant

Contact Us Today for custom solutions or volume production quotes. Our engineering team can help optimize your RF design for maximum performance.




Thank you for your reading and you're welcome to contact us for your PCB enquiries.