4 Layer Printed Circuit Board PCB with Black Solder Mask

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC1031R1.6
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Bicheng
Surface Finish
Immersion Gold
Maximum Holes
0.78mm/3.25mm
Copper Thick
1oz
Legend Color
White
Solder Mask Color
Black
Board Thick
1.6mm
Minimum Trace and Space
7.87 Mil/5.5 Mil
Via
Via Tented
Board Plating
0.0030"
Test
100% Electrical Test
Transport Package
Vacuum
Specification
117 x 136mm=1PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000 PCS/ Month

Product Description

4 Layer Printed Circuit Board PCB MultiLayer PCB With Black Solder Mask Applied In
Network Hub


Commodity Introduction
This is a type of FR-4 PCB for the application of Network Hub It's a 4 layer board at 1.6mm thick.
The base laminate is from ITEQ, Solder mask and silkscreen from Kuang Shun and Taiyo. It's
fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are
packed separately.  


Parameters & Data Sheet
PCB SIZE 117 x 136mm=1PCS
BOARD TYPE  
Number of Layers Multilayer PCB, 4 Layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 17.8um(0.5oz)+plate TOP layer
Pregpreg 508um
copper ------- 17.8um(0.5oz)
Core FR-4 508um
copper ------- 17.8um(0.5oz)
Pregpreg 508um
copper ------- 17.8um(0.5oz)+plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 7.87mil/5.5mil
Minimum / Maximum Holes: 0.78mm/3.25mm
Number of Different Holes: 10
Number of Drill Holes: 2515
Number of Milled Slots: 2
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL  
Glass Epoxy:  FR-4, ITEQ IT-180 TG>170, er<5.4
Final foil external:  1oz
Final foil internal:  0.5oz
Final height of PCB:  1.6mm ±0.16
PLATING AND COATING  
Surface Finish Immersion Gold (13.9%) 4µ" over 100µ" nickel
Solder Mask Apply To:  Top and Bottom, 12micron Minimum
Solder Mask Color:  Black, KSM-S6189BK31, Kuangshun supplied
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, Fiducial Marks
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and 
leged FREE AREA
VIA Plated Through Hole(PTH), via tented
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
APPLICATION: Network hub, Dsl Modem
Preamplifier
Gps Tracking Device
Hdmi Converter
Security System
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


PCB Capability
More than 15 years of PCB experiences
Excellent after-sales service
Substrate material: Epoxy glass (FR-4), High frequency, Metal core
Price advantages on circuit boards
Multilayer PCB and Hybrid material of Multilayer PCB
Focus on prototypes, small batches and volume production
TS16949 (2009), ISO14001 (2004), ISO9001 (2008), UL certified
Printed Circuit Board Capability
Parameter Value
Layer Counts 1-32
Substrate Material FR-4(including High Tg 170, High CTI>600V);
Aluminum based; RO4350B, RO4003C;
94HB and FR-1 (upon request)
Maximum Size Flying test: 900*600mm, Fixture test 460*380mm, 
No test 1100*600mm
Board Outline Tolerance ±0.0059" (0.15mm)
PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm) ±8%
Thickness Tolerance(t<0.8mm) ±10%
Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track 0.003" (0.075mm)
Minimum Space 0.003" (0.075mm)
Outer Copper Thickness 35µm--420µm (1oz-12oz)
Inner Copper Thickness 17µm--420µm (0.5oz - 12oz)
Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
Registration (Mechanical) 0.00197" (0.05mm)
Aspect Ratio 12:1
Solder Mask Type LPI
Min Soldermask Bridge 0.00315" (0.08mm)
Min Soldermask Clearance 0.00197" (0.05mm)
Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance ±10%
Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger



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