Double-Sided RO3010 PCB – 1.35mm Thickness, Enig Finish for High-Frequency RF Circuits

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO3010 PCB
• Model NO.: BIC-1002-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Taconic
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year
• Package Size: 50.00cm * 30.00cm * 30.00cm
• Package Gross Weight: 2.000kg

Product Description

Double-Sided RO3010 PCB - 1.35mm Thickness, 7/8 mil Trace/Space, ENIG Finish for High-Frequency RF Circuits
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of This PCB
Designed for demanding RF and microwave applications, this double-sided PCB utilizes Rogers RO3010 ceramic-filled PTFE composite to deliver exceptional electrical performance and thermal stability. Optimized for automotive radar, satellite communications, 5G infrastructure, and wireless systems, it combines high dielectric constant with excellent mechanical stability. Certified to IPC-Class-2 standards, this PCB ensures reliability in high-frequency and harsh environments.

Key Advantages:
High Dielectric Constant (10.2 ±0.3 @ 10GHz): Enables circuit miniaturization for compact designs.
Ultra-Low Signal Loss: Dissipation factor of 0.0022 @ 10GHz ensures high-frequency precision.
Superior Thermal Management: Thermal conductivity of 0.95 W/mK and operating range of -55°C to +288°C.
Cost-Effective Production: Compatible with standard PCB processes, ideal for volume manufacturing.
Global Availability: Ready for prototyping and mass production worldwide.


2. PCB Construction Details (Summary Table)

Parameter	Specification
Base Material	Rogers RO3010
Layer Count	Double-Sided
Board Dimensions	100.00mm x 100.00mm (±0.15mm)
Trace/Space (Min.)	7/8 mils
Min. Hole Size	0.25mm
Blind/Buried Vias	No
Finished Thickness	1.35mm
Copper Weight	1 oz (1.4 mils) all layers
Via Plating Thickness	1 mil
Surface Finish	ENIG (Electroless Nickel Immersion Gold)
Silkscreen	None (Top & Bottom)
Solder Mask	None (Top & Bottom)
Electrical Testing	100% tested
Impedance Control	Not required (±10%)

3. Other Key Components & Features
Stackup Structure
Top & Bottom Layers: 17µm base copper for optimal conductivity.
Dielectric Core: 50mil RO3010 substrate ensures stable impedance and thermal dissipation (0.95 W/mK).

Design & Manufacturing Specifications
Component Support: 61 components, 93 pads (37 thru-hole, 56 top SMT), 48 vias, and 10 nets.
Artwork Compatibility: Accepts Gerber RS-274-X files for seamless fabrication.
Quality Compliance: IPC-Class-2 certified for commercial-grade reliability.

Material Advantages
Low CTE: Thermal expansion coefficients (X/Y/Z: 13/11/16 ppm/°C) minimize mechanical stress.
High Thermal Decomposition (Td >500°C): Suitable for extreme environments.
Moisture Resistant: Absorption rate of just 0.05% for long-term reliability.
Optimized RF Layout: No solder mask or silkscreen reduces parasitic effects.

Typical Applications
Automotive Radar: ADAS, collision avoidance systems.
Satellite Communications: GPS antennas, direct broadcast systems.
5G Infrastructure: Power amplifiers, base station antennas.
Wireless Systems: Patch antennas, datalink modules.


Why Choose This PCB?
1. High-Frequency Performance: ENIG finish ensures reliable solderability, while 7/8 mil trace/space supports precision designs.
2. Robust Construction: 1.35mm thickness and RO3010 core provide mechanical stability.
3. Scalable Production: Cost-effective for high-volume manufacturing.


Order Now for Superior RF Performance!
Contact us to customize your design or request a quote for fast global delivery. Ideal for engineers requiring high-frequency stability and miniaturization.

Thank you for your reading and you're welcome to contact us for your PCB enquiries.