1.1 General description
This is a type of double sided PCB board built on FR-4 Tg135 substrate for the application
of Wireless Transmitter. It's 2.2 mm thick with white silkscreen on matt blue solder mask and
immersion gold on pads. The base material is from ITEQ supplying 25 up boards per panel.
They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are
packed for shipment.
1.2 Features and benifits
A. RoHS compliant and suitable for thermal reliability needs
B. SMT process is resistant to reflow soldering, resistant to rework.
C. Comprehensive equipment management and maintenance and process control
D. 30000 square meter month capability
E. 12 hours quotation
F. Free-of-charge PCB panelization
1.3 Application
CCTV, Wireless Modem, Control System, Small Led Lights, 3G Signal Booster, 2000W
Inverter, WiFi Directional Antenna, Modem GPRS, GPS Vehicle Tracking Devices,
Signal transmission
1.4 Parameter and data sheet
Number of Layers |
2 |
Board Type |
Double Sided PCB |
Board Size |
291.08 x 195.88mm=25UP |
Board Thickness |
2.2mm +/-0.22 |
Board Material |
FR-4 |
Board Material Supplier |
ITEQ |
Tg Value of Board Material |
135ºC |
|
PTH Cu thickness |
≥20 um |
Inner Iayer Cu thicknes |
N/A |
Surface Cu thickness |
35 um (1oz) |
|
Solder Mask Type and Model No. |
LPSM, KSM-S6189BL31 |
Solder Mask Supplier |
KUANGSHUN |
Solder Mask Colour |
Matt Blue |
Number of Solder Masks |
2 |
Thickness of Solder Mask |
13um |
|
Type of Silkscreen Ink |
IJR-4000 MW300 |
Supplier of Silkscreen |
TAIYO |
Color of Silkscreen |
White |
Number of Silkscreen |
1 |
|
Mininum Trace (mil) |
7 mil |
Minimum Gap(mil) |
7mil |
|
Surface Finish |
Immersion gold |
RoHS Required |
Yes |
Warpage |
0.10% |
|
Thermal Shock Test |
Pass, 288±5ºC,10 seconds, 3 cycles.
No delamination, no blistering. |
Solderablity Test |
Pass, 255±5ºC,5 seconds Wetting Area Least 95% |
Function |
100% Pass electrical test |
Workmanship |
Compliance with IPC-A-600H & IPC-6012C Class 2 |
Drill table (mm) |
T1: 0.710 |
Our different PCB's
Disposal prior to Solder mask